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Bionic light heat insulation sandwich structure and preparation method thereof

A sandwich structure, lightweight thermal insulation technology, applied in ceramic products, other household appliances, layered products, etc., can solve the problems of low structural strength, unfavorable filling of thermal insulation materials, etc., to reduce thermal conductivity and actively save energy Value, excellent mechanical properties

Active Publication Date: 2021-12-17
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, the present invention provides a bionic lightweight heat-insulating sandwich structure and its preparation method to overcome the disadvantages in the related art that the heat-insulating board sandwich structure is not connected to the outside, which is not conducive to the filling of heat-insulating materials, and the structural strength is low.

Method used

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  • Bionic light heat insulation sandwich structure and preparation method thereof
  • Bionic light heat insulation sandwich structure and preparation method thereof
  • Bionic light heat insulation sandwich structure and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] This example prepares a bionic lightweight heat-insulating sandwich material, which mainly includes the following steps:

[0069] 1. Reconstruction of the bionic lightweight heat insulation model: Obtain characteristic data through Micro CT, import the 3D design software avizo for reconstruction, obtain a 3D CT model, and enlarge the obtained CT model by 16 times according to the same size, and obtain figure 2 aPrint the model and export it in stl file format for backup; after figure 1 method to get image 3 ;go through figure 1 method of c, get Figure 4 ;

[0070] 2. Preparation of photosensitive ceramic precursor slurry: Weigh 5g of vinylmethyl siloxane, add 1wt% free radical scavenger 2,6-di-tert-butyl-p-cresol, and then ultrasonicate for 10min to obtain a clear solution. After adding 5g of mercaptopropylmethylsiloxane, ultrasonic 10min was added to obtain a clear solution, and then 0.5wt% photoinitiator Omnirad 819 was added and mixed by ultrasonic 10min to ob...

Embodiment 2

[0076] This example prepares a bionic lightweight heat-insulating sandwich material, which mainly includes the following steps:

[0077] 1. Reconstruction of the bionic lightweight heat insulation model: Obtain the characteristic data through Micro CT, import the 3D design software avizo to reconstruct, obtain the CT model, enlarge the obtained CT model by 16 times according to the same size, obtain the printed model, and Export in stl file format for backup;

[0078] 2. Preparation of photosensitive ceramic precursor slurry: Weigh 1g of vinylmethyl siloxane, add 1wt% free radical scavenger 2,6-di-tert-butyl-p-cresol, and ultrasonicate for 10 minutes to obtain a clarified slurry. After adding 9g of mercaptopropylmethylsiloxane, ultrasonic 10min was added to obtain a clarified slurry, and then 0.5wt% photoinitiator Omnirad 819 was added for 10min ultrasonic mixing to obtain a photosensitive ceramic precursor slurry;

[0079] 3. 3D printing of bionic lightweight heat-insulating...

Embodiment 3

[0083] This example prepares a bionic lightweight heat-insulating sandwich material, which mainly includes the following steps:

[0084] 1. Reconstruction of the bionic lightweight heat insulation model: Obtain the characteristic data through Micro CT, import the 3D design software avizo to reconstruct, obtain the CT model, enlarge the obtained CT model by 16 times according to the same size, obtain the printed model, and Export in stl file format for backup;

[0085] 2. Preparation of photosensitive ceramic precursor slurry: Weigh 9g of vinylmethyl siloxane, add 1wt% free radical scavenger 2,6-di-tert-butyl-p-cresol, and then ultrasonicate for 10min to obtain a clarified slurry. After adding 1g of mercaptopropylmethylsiloxane, ultrasonication was performed for 10 minutes to obtain a clarified slurry, and then 0.5wt% photoinitiator Omnirad 819 was added to be ultrasonically mixed for 10 minutes to obtain a photosensitive ceramic precursor slurry;

[0086] 3. 3D printing of bi...

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Abstract

The invention relates to a bionic light heat insulation sandwich material sandwich structure and a preparation method thereof. The sandwich structure comprises sine-wave-shaped thin-wall structures existing in different amplitude forms, and the thin-wall structures are uniformly arranged in a special mode that the thin-wall structures are almost arranged at equal intervals but are uncertain in direction. The upper end and the lower end of the sandwich structure are sealed by an upper sealing panel and a lower sealing panel, and the interior of the sandwich structure has high porosity of 50-95% and is communicated with each other, so that thermal insulation materials such as aerogel can be conveniently filled; and the sandwich structure further comprises relatively parallel sine wave pattern thin-wall structures obtained after features are extracted from a natural material and sine wave pattern thin-wall structures containing different numbers of rib-shaped secondary reinforcing structures. The special structure is realized by a 3D printing technology. Compared with a traditional heat insulation sandwich structure, the bionic light heat insulation sandwich structure has the excellent heat insulation characteristic and good mechanical property, meanwhile, the density is ultralow, and the bionic light heat insulation sandwich structure has wide application prospects in the fields of heat protection and high-temperature heat insulation.

Description

technical field [0001] The invention belongs to the technical field of heat insulation materials, and in particular relates to a bionic lightweight heat insulation sandwich structure and a preparation method thereof. Background technique [0002] Sandwich panels have many excellent characteristics such as high strength, good heat insulation, lightweight structure, etc., so they have been widely used in aerospace, transportation, ships, construction and other fields. The existing sandwich panel structure is mainly two kinds of honeycomb structure and corrugated structure. Because the honeycomb structure inside each honeycomb unit is closed to each other, it is difficult to fill airgel, foam material and other materials when it is used as a heat insulation material. Therefore, Its thermal insulation performance is insufficient; and although the corrugated structure is convenient for foaming material filling, its mechanical strength is insufficient. [0003] Existing thermal p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B38/00C04B35/56B33Y70/00B33Y10/00B32B33/00B32B3/08
CPCC04B38/0006C04B35/56B32B33/00B32B3/085B33Y10/00B33Y70/00B32B2307/304C04B2235/6026C04B2235/77C04B2235/9607
Inventor 张兴张卓卿李靖晗曹磊杨锐
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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