Method for improving alignment hole deviation
A technology of offset holes and hole positions, which is applied in the field of PCB manufacturing, can solve the problems of inaccurate alignment of alignment holes, etc., and achieve the effects of reducing heat, ensuring exposure alignment, and reducing vibration
Pending Publication Date: 2021-12-17
安捷利美维电子(厦门)有限责任公司 +1
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- Application Information
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Problems solved by technology
[0005] In order to overcome the deficiencies of the prior art, one of the purposes of the present invention is to provide a method for improving the misaligned holes, which can solve the problem of inaccurate alignment of the alignment holes
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[0028] Below, the present invention will be further described in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of not conflicting, the various embodiments described below or the technical features can be combined arbitrarily to form new embodiments. .
[0029] It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or there can also be an intervening component. When a component is said to be "connected" to another component, it may be directly connected to the other component or there may be intervening components at the same time. When a component is said to be "set on" another component, it may be set directly on the other component or there may be an intervening component at the same time. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only.
[0030] Un...
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The invention discloses a method for improving alignment hole deviation. The method comprises the following steps of: selecting hole position coordinates of a to-be-processed plate, and performing identification treatment; detecting the size of a to-be-processed hole site, and selecting a drill bit with a drilling specification of D2 for processing; selecting a drill bit with a drilling specification of D1 to process a primary processing plate; carrying out copper deposition and electroplating treatment on a secondary processing plate; and carrying out film pasting, alignment exposure and development, etching and film stripping on the electroplating plate to expose a required pattern on the PCB. According to the invention, the alignment holes are continuously processed in a mode that drill bits of multiple specifications are adopted for continuous processing, the torque needed by the drill bits of a drilling machine is small when small holes are drilled, the influence degree on the hole walls is low, drilling of the small holes is beneficial to heat dissipation, dissolution of materials is avoided, and finally the alignment holes are drilled through a drilling tool with the same diameter as the alignment holes, so that the torque required by the drilling machine can be reduced, the vibration can be reduced, the heat can be greatly reduced, a good hole pattern can be drilled, the subsequent exposure alignment can be finally ensured, and the problem of hole deviation can be avoided.
Description
technical field [0001] The invention relates to the field of PCB manufacturing, in particular to a method for improving alignment deviation holes. Background technique [0002] At present, with the continuous upgrading of electronic products, the PCB manufacturing process continues to develop towards refinement. Small-area multi-functional products put forward higher requirements on the production process. Under the requirements of making small-area multi-functional products in PCB, the number of blind holes is increasing continuously, and the aperture of blind holes is also shrinking. The exposure alignment between layers is particularly important. If there is inaccurate alignment, it will affect the signal transmission between layers. , which ultimately affects the functional reliability of the product. [0003] However, the existing PCB manufacturing has the following defects: [0004] Please refer to the attached figure 2 , when the PCB manufacturing process on the m...
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IPC IPC(8): H05K3/00
CPCH05K3/0008H05K3/0047Y02P70/50
Inventor 关俊轩刘勇许杏芳
Owner 安捷利美维电子(厦门)有限责任公司