Rapid preparation method of high-thermal-conductivity carbon copper

Abstract

The invention discloses a rapid preparation method of high-thermal-conductivity carbon copper. The method comprises the steps of mixing, reduction treatment, charging and vacuum sintering as well as cooling; carbon powder and copper powder are mixed in proportion, the carbon powder can be better wrapped by the copper powder in the ball milling process under mechanical occlusion stirring of a high-energy ball mill, the homogeneity of the powder reaches the optimal state, the mixing time is relatively short, then a mold is filled with the powder for charging and sintering, the powder rapidly reaches the plasticized state through adjustment of the temperature rising speed, rapid forming is conducted under the pressure of 80 Mpa or above, and the carbon-copper alloy is completely compact; meanwhile, according to the technology, in a vacuum state, the temperature is lower than that of a common technology and is uniform, so that the sintering and alloying time is short, whole production is efficient and continuous, the technology is high in efficiency, the heat conductivity of the sintered and formed carbon-copper alloy can reach 670 W / m.k or above, the strength is improved accordingly, and the application of the carbon-copper alloy in the fields of substrates, semiconductors and electronic packaging can be better met.

Description

technical field [0001] The invention belongs to the technical field of carbon-copper alloy production, and in particular relates to a method for preparing carbon copper with high thermal conductivity. Background technique [0002] Carbon-copper alloy has the thermal conductivity and good layering of carbon, as well as the strength and electrical conductivity of copper, and has great market application prospects. However, carbon-copper alloy is a material that is extremely difficult to form densely and achieve high thermal conductivity. The carbon-copper alloy produced by the traditional molding process commonly used in the market has uneven material distribution, loose compactness, and poor thermal conductivity. The thermal conductivity can only reach the thermal conductivity of copper, which is 310-350W / m.k, which cannot meet market needs at all. As a result, the application of carbon-copper alloys cannot be promoted very well, and even if they are applied, they are only re...

AI Technical Summary

Problems solved by technology

[0002] Carbon-copper alloy has the thermal conductivity and good layering of carbon, as well as the strength and electrical conductivity of copper, and has a great market application prospect. However, carbon-copper alloy is a material that is extremely difficult to form densely and achieve high thermal conductivity.

The carbon-copper alloy produced by the traditional molding process commonly used in the market has uneven material distribution, loose compactness, and poor thermal conductivity. The thermal conductivity can only reach the thermal conductivity of copper, which is 310-350W / m.k, which cannot meet market needs at all. As a result, the application of carbon-copper alloys is not well promoted, and even if they are applied, they are only barely used in the case of reducing the performance of the material

At the same time, the current production of carbon-copper alloys still has the problems of long production cycle and low efficiency.

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