Circuit measuring system for substrate

Abstract

The invention discloses a circuit measuring system for a substrate. The circuit measuring system comprises a first light source, a second light source, image capturing equipment and an image processing device. The first light source provides a first color light beam to a substrate to display a first region feature of the substrate. The second light source provides a second color light beam to the substrate so as to display a second area characteristic of the substrate. The image capturing equipment captures an image of the substrate to obtain the first region feature and the second region feature. The image processing device is connected to the image capturing device and analyzes the first region feature and the second region feature to obtain line information. According to the invention, the image contrast among a plurality of feature areas on the line can be effectively increased, so that the accuracy of line measurement can be improved, and the accuracy of detection is further improved.

Description

technical field [0001] The invention relates to a circuit measurement system, in particular to a circuit measurement system for a substrate which improves the contrast ratio of a circuit through a multi-color light source. Background technique [0002] With the progress of the fully automated industry, Automatic Optical Inspection (AOI) has been widely used in the visual inspection of circuit board assembly production lines in the electronics industry and has replaced the previous manual visual inspection (Visual Inspection). [0003] The automatic optical identification system is a common representative method in the industrial process. The main method is to use the camera device to take pictures of the surface state of the object to be tested, and then use computer image processing technology to detect defects such as foreign objects or abnormal patterns. Due to the use of non-contact Formal inspection, so it can be used to inspect semi-finished products during the product...

AI Technical Summary

Problems solved by technology

[0005] With the increasing frequency of circuit signals and the trend of thinner circuit board lines, the cross-sectional area consistency of circuit board lines is more critical to the image of circuit characteristics such as resistance and impedance. Slight changes will lead to poor performance of final electrical appliances expected

[0006] The circuit inspection of traditional circuit boards mostly uses black and white cameras and diffuse light sources, which will make it difficult to identify the upper and lower lines of the circuit, especially when the edge of the upper line has a curved corner. Inaccurate, and incorrect calculation of line cross-sectional area

[0007] On the other hand, in the traditional 3D inspection of lines, Confocal microscopy, triangular reflection technology, white light interference technology, etc. are mainly used to establish 3D models by point measurement. Not only the measurement time Too slow, it is difficult to carry out a large number of inspections, due to the limitation of point measurement, only local height information can be obtained, and it is difficult to combine into complete line cross-sectional area information

Images