A kind of flame retardant high heat resistance low dielectric benzoxazine resin and preparation method thereof
A benzoxazine, high heat-resistant technology, applied in the field of thermosetting resins, can solve the problems of not being able to meet the requirements of high performance and unsatisfactory performance, and achieve the effects of ensuring integrity, improving thermal performance, and increasing the degree of crosslinking
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Embodiment 1
[0043] 0.380mol 3-(3-ethynylphenyl)-3,4-dihydro-2H-1,3-benzoxazine (Ph-apa) and 0.017mol bis(N-ethynylphenylphthalate) imide) hexafluoroisopropane (m-EFDA) was added to 1.88mol dichloromethane, stirred until completely dissolved, and the solvent was removed by rotary evaporation to obtain a uniformly distributed mixture, and then placed in a vacuum with a vacuum degree of 0.08MPa at 160°C Defoaming in an oven for 0.5h, defoaming in a vacuum oven with a vacuum degree of 0.08MPa at 190°C for 0.5h, pouring into the mold and curing at normal pressure according to the following procedure: 190°C / 2h+210°C / 2h+230°C / 3h, demoulding, to obtain a black sample 1 with a flat surface, named BOZ90.
Embodiment 2
[0045] The rest are the same as in Example 1, except that the amount of 3-(3-ethynylphenyl)-3,4-dihydro-2H-1,3-benzoxazine used is 0.340 mol part and bis(N- The amount of ethynyl phenyl phthalimide) hexafluoroisopropane is 0.036 mol part, and the product is BOZ80.
Embodiment 3
[0047] The rest are the same as in Example 1, except that the amount of 3-(3-ethynylphenyl)-3,4-dihydro-2H-1,3-benzoxazine used is 0.298mol and bis(N-acetylene) The amount of phenyl phthalimide) hexafluoroisopropane is 0.050mol, and the product is BOZ70.
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