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A kind of flame retardant high heat resistance low dielectric benzoxazine resin and preparation method thereof

A benzoxazine, high heat-resistant technology, applied in the field of thermosetting resins, can solve the problems of not being able to meet the requirements of high performance and unsatisfactory performance, and achieve the effects of ensuring integrity, improving thermal performance, and increasing the degree of crosslinking

Active Publication Date: 2022-07-22
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above technologies either use copolymerization modification or molecular design to introduce the rigid structure of imide ring into benzoxazine thermosetting resin, and further increase the degree of crosslinking. The obtained thermosetting resin has good dielectric properties and thermal properties. But these two properties are still unsatisfactory and cannot meet people's requirements for high performance. Therefore, it is urgent to further improve the dielectric properties and thermal properties of benzoxazine resins.

Method used

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  • A kind of flame retardant high heat resistance low dielectric benzoxazine resin and preparation method thereof
  • A kind of flame retardant high heat resistance low dielectric benzoxazine resin and preparation method thereof
  • A kind of flame retardant high heat resistance low dielectric benzoxazine resin and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0043] 0.380mol 3-(3-ethynylphenyl)-3,4-dihydro-2H-1,3-benzoxazine (Ph-apa) and 0.017mol bis(N-ethynylphenylphthalate) imide) hexafluoroisopropane (m-EFDA) was added to 1.88mol dichloromethane, stirred until completely dissolved, and the solvent was removed by rotary evaporation to obtain a uniformly distributed mixture, and then placed in a vacuum with a vacuum degree of 0.08MPa at 160°C Defoaming in an oven for 0.5h, defoaming in a vacuum oven with a vacuum degree of 0.08MPa at 190°C for 0.5h, pouring into the mold and curing at normal pressure according to the following procedure: 190°C / 2h+210°C / 2h+230°C / 3h, demoulding, to obtain a black sample 1 with a flat surface, named BOZ90.

Embodiment 2

[0045] The rest are the same as in Example 1, except that the amount of 3-(3-ethynylphenyl)-3,4-dihydro-2H-1,3-benzoxazine used is 0.340 mol part and bis(N- The amount of ethynyl phenyl phthalimide) hexafluoroisopropane is 0.036 mol part, and the product is BOZ80.

Embodiment 3

[0047] The rest are the same as in Example 1, except that the amount of 3-(3-ethynylphenyl)-3,4-dihydro-2H-1,3-benzoxazine used is 0.298mol and bis(N-acetylene) The amount of phenyl phthalimide) hexafluoroisopropane is 0.050mol, and the product is BOZ70.

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Abstract

A flame-retardant high heat-resistant low-dielectric benzoxazine resin and a preparation method thereof, the resin has the structure shown in the following claims, the present invention is based on an alkynyl-containing benzoxazine monomer and an alkynyl-containing amide Amine monomers are used as raw materials to introduce bulky rigid imide structures into benzoxazine resins. Curing and cross-linking, the cross-linking temperature of the alkynyl group is consistent with the ring-opening curing temperature of the benzoxazine monomer. It is greatly improved, and on the other hand, it inherits the excellent dielectric properties of alkynyl imide monomers. The unexpected discovery of the present invention is that the two monomers, alkynyl-containing benzoxazine and alkynyl-containing imide, have the effect of synergistically improving the flame retardancy of the resin. In addition, the appropriate introduction of F-containing groups is conducive to further improving the overall performance. .

Description

technical field [0001] The invention belongs to the technical field of thermosetting resins, and in particular relates to a flame-retardant high-heat-resistance low-dielectric benzoxazine resin and a preparation method thereof. Background technique [0002] Benzoxazine (BOZ) is a new type of phenolic resin, which overcomes the shortcomings of traditional phenolic resins that require additives and release small molecules during curing. It has strong molecular design, excellent flame retardant properties and electrical properties, mechanical properties and heat resistance. Because of its high performance, benzoxazine resins are widely used in aviation, construction, electronics and other fields. However, with the rapid development of aerospace and electronic information fields, the existing benzoxazine resins cannot meet the requirements of high performance, especially thermal properties and dielectric properties (the dielectric constant of ordinary benzoxazine resins is about...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G14/073C08G73/12C08G73/10
CPCC08G14/06C08G73/125C08G73/126C08G73/1067C08G73/1039C08G2270/00
Inventor 李向梅陈丹丹刘奔奔何吉宇杨荣杰
Owner BEIJING INSTITUTE OF TECHNOLOGYGY