Welding chopper and welding equipment

Abstract

The invention discloses a welding chopper and welding equipment. The welding chopper is provided with a wire passing through hole, the wire passing through hole extends to the end of the welding chopper, the position, close to the end of the welding chopper, of the wire passing through hole is provided with a conical inner wall surface expanding outwards, and the conical inner wall surface is connected with the outer wall surface of the welding chopper through arc-shaped wall surfaces; the arc-shaped wall surfaces comprise a first arc-shaped wall surface and a second arc-shaped wall surface, the first arc-shaped wall surface is closer to the end of the welding chopper relative to the second arc-shaped wall surface, the first arc-shaped wall surface is in transition connection with the outer wall surface of the welding chopper through the second arc-shaped wall surface, and the second arc-shaped wall surface is in transition connection with the conical inner wall surface through the first arc-shaped wall surface; and the radius of the first arc-shaped wall surface is R1, and R1 is larger than 0 and smaller than or equal to 15 micrometers. According to the welding chopper and the welding equipment, the concentration ratio, to the stress of a welding ball, of the welding chopper can be reduced, craters, caused by stress concentration, of a chip bonding pad are reduced, the concentration of tangent line tail force when a second welding spot is welded is reduced, and the occurrence of line tail breakage in the rising process of the chopper is reduced.

Description

technical field [0001] The invention is used in the technical field of semiconductor packaging, and in particular relates to a welding chopper and welding equipment. Background technique [0002] In the production process of semiconductor integrated circuits, it is usually necessary to connect the soldering area of ​​the semiconductor bare chip with the I / 0 lead of the microelectronic package or the metal wiring welding area on the substrate with a metal filament (welding wire). [0003] Generally, the welding wire is passed through the wire hole of the chopper, and the welding wire is welded by thermocompression bonding or ultrasonic bonding (that is, under the action of heating, pressure or friction, the welding wire and the welding area The atoms on the contact surface reach the range of atomic attraction and are welded). Specifically, the welding wire is bonded with the first welding station to form a first bonding point (that is, one end of the welding wire has been fi...

AI Technical Summary

Problems solved by technology

[0005] 1. The inner chamfer between the inner hole and the outer arc is likely to increase the concentration of the solder ball stress and energy accumulation, resulting in serious aluminum extrusion and easy damage to the silicon material under the aluminum layer, resulting in craters on the chip pad

[0006] 2. When welding the second solder joint, stress concentration is prone to occur, resulting in the tail of the wire not being effectively connected to the carrier, and the tail of the wire breaks during the rising process of the chopper, causing the machine to alarm for short wire tails, resulting in hidden dangers to product quality

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