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Electronic device and cooling module

A technology for electronic equipment and cooling modules, which is applied to the structural parts of electrical equipment, cooling/ventilation/heating renovation, electrical components, etc. The effect of reducing the number of parts and achieving weight reduction

Pending Publication Date: 2022-01-14
LENOVO (SINGAPORE) PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, such a cooling module has a large number of components, and it is troublesome to assemble into the housing.
In addition, it is difficult to reduce the weight of a metal thermal diffusion plate, which increases the weight of electronic equipment

Method used

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  • Electronic device and cooling module
  • Electronic device and cooling module
  • Electronic device and cooling module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] Hereinafter, preferred embodiments of the electronic device and cooling module according to the present invention will be listed and described in detail with reference to the drawings.

[0021] figure 1 It is a schematic top view looking down on the electronic device 10 which concerns on one Embodiment from above. Such as figure 1 As shown, the electronic device 10 is a clamshell notebook PC in which a display case 12 and a case 14 are relatively rotatably connected by a hinge 16 . The electronic device according to the present invention may be a mobile phone, a smart phone, or a portable game machine, in addition to a notebook PC.

[0022] The display case 12 is a flat box thinner than the case 14 . A display 18 is mounted on the display case 12 . The display 18 has a display unit 18a for displaying images and a touch panel unit 18b for touch operations. The display unit 18 a is formed of, for example, organic EL (OLED: Organic Light Emitting Diode) or liquid crys...

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PUM

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Abstract

The invention provides an electronic device and a cooling module. The electronic device is provided with a cooling module capable of reducing the number of components and achieving light weight. The electronic device includes: a shell; a first heating body and a second heating body which are arranged in the shell; and a cooling module for absorbing heat generated by the first heating element and the second heating element. The cooling module is provided with: a steam chamber in which a sealed space is formed in a portion sandwiched between a first metal plate and a second metal plate having a larger outer shape than the first metal plate, and a working fluid is sealed in the sealed space; a metal frame formed on a portion of the second metal plate extending from the outer shape of the first metal plate; and a heat transfer plate which is supported by the metal frame and contains graphene. The steam chamber is configured to absorb heat generated by the first heating body, and the heat conducting plate is configured to absorb heat generated by the second heating body.

Description

technical field [0001] The present invention relates to electronic equipment including a cooling module and the cooling module. Background technique [0002] An electronic device such as a notebook PC (notebook personal computer) accommodates a plurality of heating elements including a CPU. Such an electronic device can mount a cooling module in the housing to diffuse the heat generated by the heating element and dissipate it to the outside. [0003] Patent Document 1: Japanese Patent No. 6469183. [0004] Conventional cooling modules generally have a structure including a steam chamber in which an operating fluid is sealed in a closed space between two metal plates, and a thermal diffusion plate formed of a copper plate. Therefore, such a cooling module has a large number of parts and is troublesome to assemble into the casing. In addition, it is difficult to reduce the weight of a metal thermal diffusion plate, which increases the weight of electronic equipment. Conte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20G06F1/203H05K7/2039G06F1/206H05K7/20136
Inventor 内野显范上村拓郎山崎央天野将之
Owner LENOVO (SINGAPORE) PTE LTD