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Welding flux for soldering and soldering paste composition

A soldering and flux technology, applied in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problem of not necessarily exerting sufficient performance, and achieve the effect of reducing the number of pieces, improving the quality and reducing the cost.

Inactive Publication Date: 2008-03-12
DENSO CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, although the flux described in JP-A-2004-130374 or JP-A-2004-291019 has improved wettability with respect to plating of a specific metal type (specifically, palladium plating or copper plating), Does not necessarily exhibit sufficient performance compared to other metals or plating, especially copper oxide or nickel plating, where wettability has become a problem in recent years

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6 and comparative example 1～4

[0033] Each component shown in Table 1 was mixed with the compounding composition shown in Table 1, heated sufficiently and dissolved uniformly, and each flux was obtained.

[0034] Each obtained flux was evaluated by the following method. The results are shown in Table 1.

[0035]

[0036] Various platings (tin plating, nickel plating, palladium plating, Gold plating, silver plating, tin-copper alloy plating, tin-bismuth alloy plating) SOP parts. After temporarily fixing 10 (total 70) of these SOP parts by each plating, the alloy was applied. After soldering the flux-coated substrate with a jet soldering device, observe the SOP parts with a 20-magnification stereomicroscope to determine the presence or absence of solder dents in the electrode parts of the parts. In the case where there were solder sinks, the number (the number of occurrences of defects) was counted. Next, as the defect rate (%), a value obtained by expressing the ratio of the number of defective occurre...

Embodiment 7～12 and comparative example 5～8

[0043] Each component shown in Table 2 was mixed in the compounding composition shown in Table 2, heated sufficiently and dissolved uniformly, and each flux was obtained.

[0044] Next, each flux and Sn-Ag-Cu alloy (Sn:Ag:Cu=96.5:3.0:0.5 (weight ratio)) obtained by mixing flux:solder alloy powder=11:89 (weight ratio) constituted Solder alloy powder (particle size: 38-25 μm) was used to obtain solder paste compositions.

[0045] Each obtained solder paste composition was evaluated by the following method. The results are shown in Table 2.

[0046]

[0047] On a substrate having a QFP (Quad Flat Package) pattern with a pitch of 0.8 mm and 100 lead wires, a solder paste composition was printed with a metal mask having the same pattern and a thickness of 200 μm. On the other hand, QFP parts subjected to various platings (tin plating, nickel plating, palladium plating, gold plating, silver plating, tin-copper alloy plating, tin-bismuth alloy plating) were prepared. Ten (total ...

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PUM

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Abstract

A soldering flux contains a base resin and an activating agent. The soldering flux contains, as the activating agent, an oxygen-containing heterocyclic compound having at least one carboxyl group in a molecule. A solder paste composition contains the abovementioned soldering flux and the solder alloy powder. These enable exhibition of excellent wettability to lead-free metals and plating, irrespective of the type of the metals.

Description

technical field [0001] The present invention relates to a soldering flux and a solder paste composition used, for example, when mounting electronic components on a circuit board. In particular, it relates to a soldering flux and a solder paste composition preferably used for soldering of electronic components such as electrode parts on which lead-free plating has been applied. Background technique [0002] Soldering has been widely used for mounting electronic parts on printed circuit boards. As a soldering method, generally, it is a method of removing the oxide film on the surface of the metal to be joined with a flux followed by soldering, or using a solder paste composition mixed with a solder alloy powder and a flux to remove the oxide film at the same time and soldering methods, etc. The flux used in the former method usually contains a paste resin, an activator, and a solvent if necessary, and is often designed to have a low viscosity that can be easily applied to th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
CPCB23K35/0244B23K35/025B23K35/362C08K5/1535C08K5/16C08K5/04B23K35/36
Inventor 山本政靖盐见巧中西研介渡部昌大相原正巳
Owner DENSO CORP
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