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Graphene laminated board as well as preparation method and application thereof

A graphene layer and graphene technology, applied in the field of graphene, can solve the problems of high operating energy requirements, difficult to meet large-scale production, etc., and achieve the effect of improving mechanical properties

Pending Publication Date: 2022-01-14
SHENZHEN HANKE NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the operating energy requirements are too high to meet the needs of mass production

Method used

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  • Graphene laminated board as well as preparation method and application thereof
  • Graphene laminated board as well as preparation method and application thereof
  • Graphene laminated board as well as preparation method and application thereof

Examples

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preparation example Construction

[0030] The preparation method of the graphene laminate comprises the step of annealing at 1000° C., and the step of applying mechanical compression at 150° C. and 5 MPa to the graphene foil to obtain the graphene laminate, and the annealing and mechanical compression are carried out simultaneously.

[0031] Wherein, the specific operation of the mechanical compression is to place a pair of ultra-smooth stainless steel plates on both sides of the graphene foil, and apply a pressure of 5 MPa in an environment of 150°C.

[0032] Further, the graphene foil is prepared by printing graphene slurry on a carrier plate.

[0033] The carrier plate can be glass slide or aluminum foil, and can also be one of PET, PI, PC and other polymer substrates.

[0034] Wherein, when a glass slide is selected as the carrier plate, isopropanol should be used to clean its surface; preferably, the thickness of the aluminum foil is 18-80 μm.

[0035] Further, the graphene slurry is a water-based graphen...

Embodiment 1

[0048] The preparation method of graphene laminate comprises the steps:

[0049] S1. Use an automatic template printer (DEK Horizon n03iX) to print the graphene slurry on the surface of an aluminum foil with a thickness of 20 μm, the printing thickness is 3 to 5 mm, and dry it in a hot air oven at 150 ° C for 5 hours. Graphene film is formed on the surface of aluminum foil;

[0050] S2, immersing the graphene film in water to release the graphene film from the surface of the aluminum foil, and utilizing a semi-automatic blade coater (MTI company) to prepare a graphene foil of a larger size (at least 125mm * 200mm) with the released graphene film, and Air-dry the graphene foil for 3 hours at a wind speed of 10km / h;

[0051] S3. Place the air-dried graphene foil between a pair of smooth stainless steel plates. In a tube furnace, under a nitrogen atmosphere, anneal the graphene foil at 1000°C at a heating rate of 3°C / min. ℃, 5MPa mechanical compression (press, Caver Company), a...

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Abstract

The invention belongs to the technical field of graphene, and relates to a graphene laminated board as well as a preparation method and application thereof. The preparation method comprises the steps of annealing at 1000 DEG C; and performing mechanical compression on graphene foil at 150 DEG C and 5 MPa to obtain the graphene laminated board. The annealing and the mechanical compression are performed at the same time. The tensile strength of the prepared graphene laminated board can reach 62 MPa, the bending modulus can reach 11 GPa, the Young modulus can reach 25 GPa, the highest conductivity of the graphene laminated board with the thickness of 15 microns can reach 82790 S / m, and the electromagnetic shielding effectiveness of the graphene laminated board with the thickness of 15 microns can reach 40 dB in the testing environment of 0.8-2.6 GHz.

Description

technical field [0001] The invention belongs to the technical field of graphene, in particular to a graphene laminate and a preparation method and application thereof. Background technique [0002] With its rapid development, modern electronic products with high integrated circuits will produce serious electromagnetic radiation, which has become a serious environmental problem due to its adverse effects on equipment performance and the surrounding environment. Great efforts have therefore been made in developing high-performance electromagnetic interference (EMI) shielding materials, especially in developing the integration of low-weight, ultra-flexible materials with excellent EMI shielding effects. These demands are especially important in next-generation automobiles, portable electronics, and wearable devices, because multiple electronic components are packaged in a smaller area and require them to run at a faster speed, resulting in a substantial increase in EMI and caus...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00C01B32/194
CPCH05K9/0081C01B32/194
Inventor 易典
Owner SHENZHEN HANKE NEW MATERIAL TECH CO LTD
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