Large-area quartz wafer grinding device and grinding method

Abstract

The invention discloses a large-area quartz wafer grinding device and grinding method. The grinding device is provided with a base, supporting arm assemblies, a grinding disc, a rotating seat, a rotating motor, a carrying block and a disc repairing ring; the base is a square base arranged on a horizontal plane, and the supporting arm assemblies are arranged at the two ends of the diagonal line of the base; the supporting arm assemblies comprise swing arms, swing arm shafts, swing arm motors, adjustable arms and rollers, wherein the lower ends of the swing arm shafts are connected to the swing arm motors, the upper ends of the swing arm shafts are fixedly assembled with one ends of the swing arms, the middles of the swing arms are assembled with one ends of the adjustable arms, and the rollers are arranged at the other ends of the swing arms and the other ends of the adjustable arms; the grinding disc is arranged on the rotating seat; the rotating seat is driven by a rotating motor to operate; and the carrying block is sleeved in the disc repairing ring, and a quartz wafer is bonded on the bottom surface of the carrying block. According to the device and method, by means of the improved design in two aspects of material removal and substrate holding, the purpose of ensuring that the processing surface shape of the large-area quartz wafer meets the design requirement is achieved.

Description

technical field [0001] The invention relates to a quartz wafer grinding device and a grinding method thereof, in particular to a grinding device and a grinding method for a large-area quartz wafer. Background technique [0002] Quartz single crystal thin substrate (referred to as quartz wafer) is the core component of the quartz crystal oscillator, and its performance index (such as the frequency value of the quartz crystal) is an important factor affecting the quality of the quartz crystal oscillator product. The surface quality and thickness of the wafer determine its frequency. The good surface quality of the quartz wafer can effectively improve the force-frequency characteristics of the resonator. Any tiny defects on the surface of the quartz wafer will affect the working accuracy and reliability of the components. The processing accuracy of quartz wafers has put forward nanometer-level requirements. [0003] During the processing of quartz wafers, grinding can be used ...

AI Technical Summary

Problems solved by technology

Double-sided grinding with fixed abrasives is an effective processing method that takes into account both high surface quality and high surface shape accuracy. It can improve the bonding error of paraffin during processing and the deformation caused by the stress difference between the two surfaces of the processed substrate. However, large-area quartz crystals The thin substrate has a large diameter-to-thickness ratio and a thinner thickness. During double-sided grinding, the close contact between the large-area quartz crystal thin substrate and the grinding disc will increase the resistance during processing, resulting in damage to the thin substrate.

Therefore, double-sided grinding is mainly suitable for ultra-precision processing of thicker substrates, and is not suitable for processing thin quartz crystal substrates.

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