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Copper alloy for thin-strip chilling crystallizer, preparation method of copper alloy and thin-strip chilling crystallizer

A crystallizer and copper alloy technology, applied in the field of alloy materials, can solve the problems of limited service life of thin strip chilled crystallizers, β-phase enriched grains, and uneven grains, so as to improve the chilling effect and reduce hard Brittle phase, excellent thermal fatigue resistance

Inactive Publication Date: 2022-01-21
YANTAI WANLONG VACUUM METALLURGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to solve the technical problems in the prior art that the β phase is enriched and the crystal grains are coarse and uneven, and the service life of the thin strip chilled crystallizer is limited

Method used

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  • Copper alloy for thin-strip chilling crystallizer, preparation method of copper alloy and thin-strip chilling crystallizer
  • Copper alloy for thin-strip chilling crystallizer, preparation method of copper alloy and thin-strip chilling crystallizer
  • Copper alloy for thin-strip chilling crystallizer, preparation method of copper alloy and thin-strip chilling crystallizer

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Embodiment 1

[0029] The composition of the copper alloy in this embodiment is Be: 1.70%, Co: 0.25%, Ni: 0.05%, Zr: 0.11%, and the balance is Cu.

[0030] The preparation process of the copper alloy of the present embodiment is:

[0031] (1) Melting: Add electrolytic copper, beryllium copper alloy, metal nickel, metal cobalt, and sponge zirconium into the vacuum induction furnace for melting, heat up to 1350°C for 10 minutes after melting, and vacuum cast into ingots;

[0032] (2) Forging: Forging the copper ingot obtained in step (1), the process conditions for forging are: heating to 780°C to start forging, and the final forging temperature is 650°C to obtain the required shape and size;

[0033] (3) solid solution: the blank obtained in step (2) is subjected to solid solution treatment, and the process conditions for solid solution are: heating to 790 ° C, heat preservation for 2 hours, and water cooling immediately;

[0034] (4) Aging treatment: the blank obtained in step (3) is subjec...

Embodiment 2

[0037] The composition of the copper alloy in this embodiment is Be: 1.5%, Co: 0.24%, Ni: 0.04%, Ti: 0.11%, and the balance is Cu.

[0038] The preparation process of the copper alloy of the present embodiment is:

[0039] (1) Melting: Add electrolytic copper, beryllium copper alloy, metal nickel, metal cobalt, and sponge titanium into the vacuum induction furnace for melting, heat up to 1350°C for 10 minutes after melting, and vacuum cast into ingots;

[0040] (2) Forging: Forging the copper ingot obtained in step (1), the process conditions for forging are: heating to 780°C to start forging, and the final forging temperature is 650°C to obtain the required shape and size;

[0041] (3) solid solution: the blank obtained in step (2) is subjected to solid solution treatment, and the process conditions for solid solution are: heating to 790 ° C, heat preservation for 2 hours, and water cooling immediately;

[0042] (4) Aging treatment: the blank obtained in step (3) is subjecte...

Embodiment 3

[0045] The composition of the copper alloy in this embodiment is Be: 1.7%, Co: 0.24%, Ni: 0.04%, Mg: 0.2%, and the balance is Cu.

[0046] The preparation process of the copper alloy of the present embodiment is:

[0047] (1) Melting: Add electrolytic copper, beryllium copper alloy, metal nickel, metal cobalt, and copper-magnesium alloy into the vacuum induction furnace for melting, heat up to 1350°C for 10 minutes after melting, and vacuum cast into ingots;

[0048] (2) Forging: Forging the copper ingot obtained in step (1), the process conditions for forging are: heating to 780°C to start forging, and the final forging temperature is 650°C to obtain the required shape and size;

[0049](3) solid solution: the blank obtained in step (2) is subjected to solid solution treatment, and the process conditions for solid solution are: heating to 790 ° C, heat preservation for 2 hours, and water cooling immediately;

[0050] (4) Aging treatment: the blank obtained in step (3) is sub...

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Abstract

The invention discloses a copper alloy for a thin-strip chilling crystallizer, which comprises the following components in percentage by weight: 1.2%-1.75% of Be, 0.2%-1.0% of Co+Ni, less than 0.5% of trace alloy elements and the balance Cu. According to the copper alloy, the copper alloy which is free of beta-phase enrichment and uniform and fine in crystal grain can be prepared, and the service life of the thin-strip chilling crystallizer prepared from the copper alloy is long. The invention further provides a preparation method of the copper alloy for the thin-strip chilling crystallizer and the thin-strip chilling crystallizer.

Description

technical field [0001] The invention relates to the field of alloy materials, in particular to a copper alloy for a strip quenching crystallizer, a preparation method thereof and a strip quenching crystallizer. Background technique [0002] As a continuous quenching medium, beryllium copper alloy has been widely used in many fields such as twin-roll thin strip continuous casting, aluminum alloy casting and rolling, nanocrystalline strip, amorphous strip, etc. It has high hardness, Mechanical properties, fatigue strength, elastic limit, wear resistance, corrosion resistance, high and low temperature resistance, non-magnetic, and can meet the requirements of electrical conductivity and thermal conductivity. However, the traditional beryllium-copper alloys for strip chilled crystallizers are CuBe25 or C17200 alloys, and the Be content is 1.8% to 2.0%. When the Be content is too high, hard and brittle β phases are easily produced in the primary solidification process due to the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22F1/08B21J5/00B22D11/04B22D11/055C22C1/03
CPCC22C9/00C22C1/03B21J5/002C22F1/08B22D11/04B22D11/055
Inventor 王肇飞张倩倩宋涛张绥鹏孙亚鹏
Owner YANTAI WANLONG VACUUM METALLURGY
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