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Tin spraying process for thin plate of 1.2 mm and below

A process and thin plate technology, which is applied in the field of tin spraying process for thin plates of 1.2mm and below, can solve the problems of easy-to-bend air knife edge, broken scrap, stuck, etc., and achieve the effect of reducing scrap rate and improving product yield.

Pending Publication Date: 2022-01-25
KUNSHAN WANYUANTONG ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the layout of PCB is getting bigger and bigger (500*450mm size or larger). When the thickness of 1.2mm and below is lead-free HASL, it is easy to soften at a high temperature of 270 ℃, and it is easy to shake back and forth during hot air leveling. The angle difference between the front and rear air knives and the wind extrusion are easy to bend when the tin furnace is lifted and jetted, causing the plate to bend and get stuck by the guide rail and the air knife edge, resulting in jamming, breaking and scrapping

Method used

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  • Tin spraying process for thin plate of 1.2 mm and below
  • Tin spraying process for thin plate of 1.2 mm and below
  • Tin spraying process for thin plate of 1.2 mm and below

Examples

Experimental program
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Embodiment

[0049] Embodiment: a 1.2mm and below thin plate tin spraying process, comprising the following steps:

[0050] S1. Pretreatment of tin spraying: it is carried out in the tin spraying pretreatment machine, after passing through the following stations, and the conveying speed of the circuit board is 3~5m / min:

[0051] a. Feeding.

[0052] b. Acidic cleaning: remove oxidation and oil stains on the copper surface; the agent for acid cleaning is sulfuric acid with a concentration of 1-3%, and the pressure of the nozzle for pickling is 1-3kg / cm 2 .

[0053] c. Water washing before copper surface roughening: remove the acidic solution in the acid cleaning step; the volume of the water washing capacity tank is 80-100L, and it is washed twice with water, and the pressure of the nozzle is 0.5-1kg / cm 2 , the temperature is normal temperature.

[0054] d. Brush grinding: Use 800-1000 mesh nylon brush to roughen the copper surface to increase the adhesion of the copper surface.

[0055...

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Abstract

The invention discloses a tin spraying process for a thin plate of 1.2 mm and below. A circuit board is subjected to tin spraying pretreatment, tin spraying and tin spraying post-treatment, so that the treated circuit board is convenient for a customer to perform SMT workpiece printing; and with a tin spraying supporting device adopted, stable lifting of the circuit board at a furnace opening in the tin spraying process is achieved, and the rejection rate caused by breakage of a product during tin spraying is reduced.

Description

technical field [0001] The invention belongs to the technical field of circuit boards, in particular to a tin-spraying process for thin plates of 1.2 mm or less. Background technique [0002] Tin spraying is also known as hot air leveling, through high temperature and high pressure gas to achieve solder joint leveling, on the PCB (Printed Circuit Board, printed circuit board) copper surface PAD (pad) covered with a layer of tin-copper IMC (interface metal co-compound or intermetallic compound) ) alloy layer to prevent the copper surface from being oxidized, and provide a good welding base for subsequent SMT (Surface Mounting Technology) parts. The quality of tin spraying will directly affect the quality and solderability of welding parts during SMT production by subsequent customers; HASL is widely used in industrial control equipment communication products and military equipment products HASL PCB, which is currently the best treatment method for the surface treatment of ele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40
CPCH05K3/4007H05K2203/0736H05K2203/075H05K2203/14H05K2203/1105
Inventor 吴平华
Owner KUNSHAN WANYUANTONG ELECTRONICS TECH