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Film for forming protective film, composite sheet for forming protective film, and method for manufacturing semiconductor chip with protective film

A protective film, semiconductor technology, applied in semiconductor/solid-state device manufacturing, chemical instruments and methods, film/sheet release liners, etc., can solve problems such as increased production efficiency, excessive curing temperature, obstacles, etc.

Pending Publication Date: 2022-01-28
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the curing temperature of thermosetting resin exceeds 130°C, and the curing time takes about 2 hours, which hinders the improvement of production efficiency.

Method used

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  • Film for forming protective film, composite sheet for forming protective film, and method for manufacturing semiconductor chip with protective film
  • Film for forming protective film, composite sheet for forming protective film, and method for manufacturing semiconductor chip with protective film
  • Film for forming protective film, composite sheet for forming protective film, and method for manufacturing semiconductor chip with protective film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0199] The following components were mixed in the compounding ratio (mass ratio; converted to solid content) shown in Table 1, diluted with methyl ethyl ketone so that the solid content concentration was 54% by mass, and a coating agent for forming a protective film was prepared.

[0200] (a) UV curable component: an acrylic polymer (weight average molecular weight: 400,000, glass transition temperature: -10°C) with a UV curable group introduced into the side chain, which is relative to 2-hydroxyhexyl acrylate 80 parts by mass and 20 parts by mass of 2-hydroxyethyl acrylate are copolymerized with 100 moles of hydroxyl groups derived from 2-hydroxyethyl acrylate, and 80 moles of methacryloyloxyethyl obtained by the reaction of isocyanates.

[0201] (b1) Red coloring agent: diketopyrrolopyrrole red pigment (manufactured by Sanyo Color Co., Ltd., PigmentRed 264)

[0202] (b2) Black coloring agent: carbon black (manufactured by Mitsubishi Chemical Corporation, #MA600B, average pa...

Embodiment 2～3

[0208] [Examples 2-3, Comparative Examples 1-2]

[0209] Except having changed the kind and compounding quantity of each component which comprises a protective film forming film to what is shown in Table 1, it carried out similarly to Example 1, and manufactured the sheet|seat for protective film formation.

[0210] In addition, the value W / T which divided the content W (mass %) of the coloring agent by the thickness T (micrometer) of a protective film forming film in each example was calculated, and it shows in Table 1.

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Abstract

A protective film-forming film contains an ultraviolet-curable component, and has a transmittance of 8% or more with respect to light rays having a wavelength of 375 nm and a transmittance of 12% or less with respect to light rays having a wavelength of 550 nm. The protective film-forming film may further contain a colorant, and the colorant may be a red colorant.

Description

[0001] This application is based on an application date of October 23, 2015, a priority date of October 29, 2014, an application number of 201580058160.4 (international application number PCT / JP2015 / 079973), and an invention titled "Protective film forming film and protection A divisional application of the patent application for "composite sheet for film formation". technical field [0002] The present invention relates to a protective film forming film capable of forming a protective film on a workpiece such as a semiconductor wafer or a processed product obtained by processing the workpiece (for example, a semiconductor chip), a sheet for forming a protective film, and a composite sheet for forming a protective film. [0003] This application claims the priority of Japanese Patent Application No. 2014-220295 for which it applied in Japan on October 29, 2014, and uses the content here. Background technique [0004] In recent years, semiconductor devices have been manufactu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D133/14C09D163/02C09D7/61C09J7/40H01L21/683C09J7/20
CPCB32B27/20C09J7/20H01L21/67011B32B7/06B32B7/12B32B2307/4026
Inventor 小桥力也山本大辅加太章生
Owner LINTEC CORP