Horizontal copper and tin plating equipment for circuit board micropores with high aspect ratio

A high aspect ratio, microporous copper plating technology, applied in printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of heavy manual workload, poor electroplating, low efficiency, etc., to achieve good applicability and improve production efficiency , Improve the effect of conveying effect

Pending Publication Date: 2022-01-28
SHENZHEN CYPRESS IND DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the production process, the circuit board can only be placed vertically on the clamping end for clamping and fixed transportation, which leads to manual loading of the circuit board every time it is transported horizontally, and manual removal after the completion of electroplating. Horizontally placed output, there is a problem of large manual workload and low efficiency, and it is aimed at high-end PCB boards with high aspect ratios during the electroplating process because the board itself is in a vertical state, and there are also cases of poor electroplating in the hole

Method used

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  • Horizontal copper and tin plating equipment for circuit board micropores with high aspect ratio
  • Horizontal copper and tin plating equipment for circuit board micropores with high aspect ratio
  • Horizontal copper and tin plating equipment for circuit board micropores with high aspect ratio

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Experimental program
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Effect test

Embodiment 1

[0042] Embodiment 1: refer to figure 1 , is a kind of horizontal high aspect ratio circuit board microporous copper-plating and tin-plating equipment disclosed by the present invention, comprising a body 1, a feeding device 2, a first water washing device 3, and a pickling device arranged in sequence along the length direction of the body 1 4. Tin plating device 5 or copper plating device 51, second washing device 6, discharge device 7 and drying device 8, and the body 1 is provided with a conveyor for horizontally clamping the circuit board from the end of the feeding device 2 mechanism, the head end of the conveying mechanism is located between the feeding device 2 and the first washing device 3, and the end of the conveying mechanism is located between the second washing device 6 and the discharging device 7; thus the circuit board is conveyed horizontally in the feeding device 2 When coming over, the circuit board is firstly clamped horizontally by the conveying mechanism,...

Embodiment 2

[0051] Embodiment 2: refer to Figure 9 , is a horizontal high aspect ratio circuit board microhole copper plating and tinning equipment disclosed by the present invention. The difference between it and Embodiment 1 is that the structure of the upper clamp 20 at the clamping mechanism 13 is different. The upper clamp 20 in this embodiment The clamp 20 is L-shaped and includes a split upper body 45 and a lower body 46. A connecting sleeve 47 connecting the two is arranged between the upper body 45 and the lower body 46. Both ends of the connecting sleeve 47 are threadedly connected to the upper body 45 and the lower body 46 respectively. , one side of the connection sleeve 47 abuts against the lower clamp 21, so that the connection sleeve 47 can play a certain supporting role, keep the vertical parallelism between the upper clamp 20 and the lower clamp 21, and the lower end of the first spring 24 abuts against the connection sleeve 47 The upper end surface of the upper end surf...

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Abstract

The invention relates to horizontal copper and tin plating equipment for circuit board micropores with a high aspect ratio. The equipment comprises a machine body, and a feeding device, a first water washing device, an acid pickling device, a tin plating device or copper plating device, a second water washing device and a discharging device which are sequentially arranged along the machine body, wherein the machine body is further provided with a conveying mechanism for horizontally clamping a circuit board. The conveying mechanism comprises a transmission wheel, a conveying belt and a driving source for driving the transmission wheel to rotate, clamping mechanisms for horizontally clamping the circuit board are arranged on the conveying belt at intervals, the clamping mechanisms are electrically connected with a negative electrode, and an electrically connected positive electrode is arranged in the tin plating device or the copper plating device. After entering from the feeding device, a circuit board is sequentially subjected to primary water washing, acid pickling, tin plating or copper plating and secondary water washing under the clamping driving of the clamping mechanism, finally discharged and dried, the circuit board is clamped in a horizontal state after being horizontally conveyed to a specified position by the feeding device, and the circuit board is loosened after electroplating is completed and then discharging is achieved. Manual feeding and discharging are not needed, and the production efficiency is higher.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a device for plating copper and tin on microholes of a horizontal high-aspect-ratio circuit board. Background technique [0002] At present, electroplating is one of the important processes in the manufacturing process of PCB boards. It is the process of depositing and forming coatings on the substrate by electrolysis. At present, most electroplating industries use vertical continuous electroplating equipment. [0003] For example, the Chinese patent with the notification number CN201801626U discloses a vertical electroplating line electroplating equipment and its fixture. The operating fixture for the vertical electroplating line includes: a first clamping edge, a second clamping edge, an elastic member, a handle and a push rod; The corresponding end between the first clamping edge and the second clamping edge is the clamping end, and the other end is the operating end; t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/00C25D17/06C25D19/00C25D7/00H05K3/18
CPCC25D17/00C25D17/06C25D7/00H05K3/188
Inventor 王春锋
Owner SHENZHEN CYPRESS IND DEV CO LTD
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