Semiconductor device with self-adaptive heat dissipation function

Abstract

The invention relates to the technical field of semiconductors, and discloses a semiconductor device with a self-adaptive heat dissipation function. The semiconductor device comprises a main board, a processor is arranged at the top of the main board, a heat conduction block sleeves the surface of the processor, the top of the processor is in contact with the bottom of a heat conduction plate, a fan is fixedly connected to the front part of the heat conduction block, the inner wall of the heat conduction plate is rotatably connected with cooling fins, the inner walls of the cooling fins are rotatably connected with a telescopic plate, the surfaces of the cooling fins are provided with a cleaning mechanism, and an air bag is arranged between the telescopic plate and the heat conduction plate. According to the semiconductor device of the invention, when the temperature of the processor rises, the air bag is heated and expands, due to the vertical limiting on the air bag by the telescopic plate, the air bag expands towards the two sides and pushes the cooling fins on the two sides to unfold, the direct contact area between the cooling fins and air can be increased, self-adaptive cooling can be achieved under the condition that the rotating speed of a fan is not changed, convenience is achieved, and energy consumption of a power source does not need to be increased.

Description

Technical field [0001] The present invention relates to semiconductor technology, and in particular to a semiconductor device having a heat dissipation function adaptively. Background technique [0002] In semiconductor integrated circuits, consumer electronics, communications systems, photovoltaic power generation, lighting, power and other fields have power conversion applications, such as a diode is fabricated using a semiconductor device. [0003] When the motherboard CPU using a large amount of heat will be issued, but the CPU cooling fan installed on the heat dissipation is performed only by a blower, not adaptive cooling, if in the case of a wind change, CPU load increase occurs, the temperature will be rise further, it may cause the computer to blue, if the amount of wind of the fan is directly mounted, power consumption will increase, and therefore proposes a semiconductor device having a heat dissipation function adaptive to solve the problems raised above. Inventive c...

AI Technical Summary

Problems solved by technology

[0003] The CPU of the motherboard will emit a lot of heat when it is in use, but the cooling fan installed on the CPU will only dissipate heat through blowing, and will not self-adaptively dissipate heat. If the CPU load increases under the condition of constant wind, its temperature will increase. If it rises further, it may cause the blue screen of the computer. If a fan with a large air volume is directly installed, the power consumption of the power supply will be increased. Therefore, a semiconductor device with adaptive heat dissipation function is proposed to solve the above-mentioned problems.

Images