SMD solid-state capacitor and manufacturing method thereof

A manufacturing method and capacitor technology, applied in the direction of capacitor manufacturing, electrolytic capacitor manufacturing, solid electrolytic capacitors, etc., can solve the problems of many defective ratios, large characteristic changes, large acting forces, etc., to reduce the occurrence of defects, stabilize product characteristics, The effect of improving the failure rate

Active Publication Date: 2022-01-28
ZHAOQING BERYL ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the process of producing the existing solid capacitor, there are still the following specific problems: 1. When the lead wire is flattened and bent, the required force is relatively large, and the external force is easily transmitted to the core package, causing the capacitor product to be squeezed, strained and damaged. Damaged, the characteristics change greatly after damage, and the proportion of defects is large; 2. The high-temperature reflow soldering technology commonly used during installation, when the temperature of reflow soldering is higher than the polymerization temperature, the excess unreacted substances in the core package will crack and produce SO2 gas, the formation of internal stress causes convex deformation and extrusion damage to the internal structure

Method used

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  • SMD solid-state capacitor and manufacturing method thereof
  • SMD solid-state capacitor and manufacturing method thereof
  • SMD solid-state capacitor and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A kind of manufacturing method of SMD solid capacitor, this manufacturing method comprises the following steps:

[0022] (1) Cut the anode foil, cathode foil and electrolytic paper into preset sizes, and respectively fix and connect guide pins 14 on the anode foil and cathode foil; wind the anode foil, electrolytic paper and cathode foil into a core package 11;

[0023] The guide pin 14 has a lead-out part 141, a support part 142 and a connecting part 143 connected in sequence, the lead-out part 141 is used to connect with the electrode foil (anode foil or cathode foil) of the core pack 11, and the support part 142 is used to socket the subsequent rubber plug 12, the connecting part 143 is used to be processed and welded, and the outer diameter of the supporting part 142 is larger than the outer diameter of the lead-out part 141 and the connecting part 143;

[0024] (2) Carrying out chemical conversion treatment on the core pack 11 to repair the oxide film on the surfac...

Embodiment 2

[0037] The preparation method of Example 2 is basically the same as that of Example 1, except that the interval is 0.3 mm and the gap is 0.6 mm.

[0038] The capacitors before molding, capacitors after molding, and capacitors after reflow soldering in Example 2 were tested for electrical characteristics, and the results were as follows:

[0039]

Embodiment 3

[0041] The preparation method of Example 3 is basically the same as that of Example 1, except that the interval is 1.0 mm and the gap is 0.3 mm.

[0042] The electrical characteristics of the capacitor before molding, the capacitor after molding and the capacitor after reflow soldering in Example 3 were tested for electrical characteristics, and the results are as follows:

[0043]

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Abstract

The invention discloses an SMD solid-state capacitor and a manufacturing method thereof. A manufacturing method of an SMD solid-state capacitor comprises the following steps: putting a polymerized core package into a shell, sleeving a rubber plug on a guide pin of the core package, and controlling a gap between the rubber plug and the core package; then sealing, and controlling the top plane of a seal to be higher than the top surface of the rubber plug by a certain gap; and then aging and processing forming are carried out, wherein the processing forming comprises the steps of flattening the guide pin, assembling the base and bending the guide pin to be placed in the base groove. According to the manufacturing method, the interval between the rubber plug and the core package is controlled, and the top plane of the sealing opening is controlled to be higher than the top surface of the rubber plug by a certain gap, so that the damage to a product in the SMD forming process can be reduced, the product characteristics are stabilized, the generation of badness is reduced, and the failure rate of an application end after reflow soldering is improved.

Description

technical field [0001] The invention relates to the technical field of electrolytic capacitors, in particular to an SMD solid capacitor and a manufacturing method thereof. Background technique [0002] Compared with plug-in solid capacitors, SMD solid capacitors (also known as surface mount solid aluminum electrolytic capacitors) can improve the production efficiency of electronic products, realize large-scale automated production, save manpower, time, etc., which is conducive to stimulating SMD solid capacitors The rapid development of the market, the prospect is very broad. [0003] The existing manufacturing method of SMD solid capacitors specifically includes nailing, forming, impregnating, polymerizing, shelling and sealing, aging, processing and molding, and packaging. In the process of producing the existing solid capacitor, there are still the following specific problems: 1. When the lead wire is flattened and bent, the required force is relatively large, and the ex...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G9/00H01G9/012H01G9/08H01G9/10H01G9/15H01G13/00
CPCH01G9/0029H01G9/012H01G9/15H01G9/08H01G9/10H01G9/153H01G13/003
Inventor 何东石刘泳澎伍小军陈桃桃黄文昊
Owner ZHAOQING BERYL ELECTRONICS TECH
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