Efficient radiator with air circulation mechanism

Abstract

The invention discloses an efficient radiator with an air circulation mechanism. The efficient radiator comprises a partition plate, and radiating fins are arranged at the top of the partition plate. Cooling liquid in the liquid storage box body is introduced into the heat dissipation pipeline through the second connecting pipe, the cooling liquid can absorb heat of the electronic device body on the fixed seat through flowing of the cooling liquid in the heat dissipation pipeline, then the cooling liquid flows into the heat conduction pipeline through the first communicating pipe, the cooling liquid absorbing the heat flows in the heat conduction pipeline, the heat dissipation fins on the surface of the heat conduction pipeline rapidly dissipate heat in the cooling liquid, the temperature of the cooling liquid is reduced, then the cooling liquid flows back into the liquid storage box body through the pump body, a cycle is completed, and the temperature of the cooling liquid is further reduced in cooperation with the thermoelectric refrigerating unit on the liquid storage box body; and the new low-temperature cooling liquid continues to absorb heat of the electronic device body, so the heat dissipation effect and the heat dissipation efficiency of the radiator are improved, and great convenience is brought to a user.

Description

technical field [0001] The invention relates to the technical field of radiators, in particular to a high-efficiency radiator with an air circulation mechanism. Background technique [0002] It is a device or instrument that transfers the heat generated by machinery or other appliances during the working process in time to avoid affecting its normal operation. Common radiators can be divided into air cooling, heat pipe radiators, liquid cooling, semiconductor refrigeration, and compressors according to the cooling method. Various types of refrigeration. High temperature is the enemy of integrated circuits. High temperature will not only lead to unstable operation of the system and shorten the service life, but may even burn some components, resulting in high temperature heat from inside the integrated circuit. The function of the radiator is to absorb this heat, and then Diverge to the outside to ensure that the temperature of the components is normal. Most heat sinks abso...

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Problems solved by technology

Most heat sinks absorb heat through contact with the surface of the heating component, and then transfer the heat to a distant place through various methods. With the development of electronic devices, the heat dissipation of high heat flux electronic devices has become a major problem. The conventional heat dissipation method is generally scale The heat dissipation structure of the fin radiator and fan has a very limited cooling capacity due to the low heat capacity and thermal conductivity of the air. Using this method for heat dissipation requires a high-power fan for forced convection heat exchange, and the heat dissipation effect is relatively poor. The efficiency is low, which brings great inconvenience to users, so we propose a high-efficiency radiator with an air circulation mechanism

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