Cover film and electronic component package using same

A technology of covering film and antistatic agent, which is applied in the field of electronic component packaging, can solve the problems of increased number of processes, cost, environmental pollution, etc., and achieve the effect of excellent adhesion

Pending Publication Date: 2022-02-01
DENKA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of using an anchor coating agent, the number of steps is increased to increase the cost, and there is also a problem of environmental pollution due to the organic solvent contained in the anchor coating agent.

Method used

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  • Cover film and electronic component package using same
  • Cover film and electronic component package using same
  • Cover film and electronic component package using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0119] The cover film having a 3 layer structure of the substrate layer, the intermediate resin layer, and the sealant resin layer is fabricated in order is made in the following manner. As a resin constituting the sealant resin layer, the hydrogenation resin of the three-component copolymer of 100 parts by parts by parts of the drum machine (Asahi Chemicals Co., Ltd., "Tuftec H1041", olefin component 70% by mass), and 25 parts by mass of talc, silica masterbatch (Tokyo Ink system, "PEX-ABT-16", olefin component is 50% by mass), and use uniaxial crowded The film having a thickness of 20 μm was processed. In the sealing agent film and the biaxially tie polyphenylene terephthalate (a thickness of 16 μm), the resin of the intermediate resin layer is extruded in a thickness of 13 μm by a single screw extruder, and by extrusion The laminated method is laminated to obtain a carrier belt covering the electronic component, which is the use of a drum machine to 100 parts by mass of the met...

Embodiment 2～6、8、9

[0120] Example 2 to 6, 8, 9, Comparative Examples 1, 2]

[0121] In addition to the materials and composition shown in Table 1, the cover film is obtained by the same method as in Example 1. Further, in Comparative Examples 1, 2 is an example of a case where there is no epoxidized fatty acid or a derivative thereof in a cover film formed in a three-layer configuration and in the intermediate resin layer in contact with the substrate layer.

Embodiment 7

[0123] A cover film having a 2 layer structure of the substrate layer and the sealant resin layer in order is produced in order. As a resin constituting the sealant resin layer, the hydrogenation resin of the three-component copolymer of 100 parts by parts by parts of the drum machine (Asahi Chemicals Co., Ltd., "Tuftec H1041", olefin component It is 70% by mass), 25 parts by mass of talc, silica masterbatch (Tung Yang Ink, "PEX-ABT-16", olefin component is 50% by mass), 0.156 parts by mass of epoxidated soybean oil ( Adeka system, "O-130") is mixed, and the single screw extruder is used to extrude the biaxular stretch polybenzothylene terephthalate (thickness of 16 μm) and coated a sealant having a thickness of 20 μm. The film, thereby obtaining a cover film for a carrier belt of an electronic component. At this time, an anchor, an adhesive is not used.

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Abstract

The present invention is a cover film having at least a substrate layer and a sealant resin layer. The sealant resin layer is formed such as to be in contact with one surface of the substrate layer, or is formed on an intermediate resin layer that is in contact with one surface of the substrate layer. The intermediate resin layer in contact with the substrate layer or the sealant resin layer in contact with the substrate layer contains an epoxidized fatty acid or a derivative thereof. The cover film has excellent interlayer adhesiveness without using an anchor coating agent.

Description

Technical field [0001] The present invention relates to a cover film and an electronic component package using the cover film. Background technique [0002] With the miniaturization of electronic equipment, small high performance is also developed regarding the electronic components used, and in the assembly step of the electronic device, the automatic installation of the element to the print substrate is performed. Surface mounting electronics accommodates carriers that continuously form a groove (Pocket) by thermoforming according to the shape of the electronic component. After the electronic component is hosted, the cover film overlaps the cover film in the upper surface of the carrier, and the heat seal is continuously formed in the longitudinal direction by the heating seal rod (SEAL BAR) to form a package body. . [0003] As a general structure of the cover film, the following configuration is known: on the substrate layer including a polyester film or the like, a sealant r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/36B32B27/32B32B27/30B32B27/08B65B15/04
CPCB32B27/36B32B27/32B32B27/302B32B27/08B65B15/04B32B2250/24B32B2553/00B65D73/02B65D85/38B32B2307/518B32B27/306B32B2264/1023B32B2264/1026B32B2255/10B32B2264/202B32B2264/1021B32B2255/20B32B2307/414B32B2435/00B32B2307/72B32B2264/104B65D65/406B65D65/14B32B27/20B32B27/38B32B2435/02B65D65/40
Inventor 阿津坂高范丹羽沙织齐藤岳史
Owner DENKA CO LTD
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