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Substrate processing apparatus

A substrate processing device and substrate technology, which are applied in sustainable manufacturing/processing, final product manufacturing, coating, etc., can solve problems such as problems with short circuits, and achieve the effect of preventing short circuits and maintaining uniformity

Pending Publication Date: 2022-02-01
JUSUNG ENG
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  • Abstract
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Problems solved by technology

[0007] Such a short circuit created between the first electrode and the second electrode may be problematic because radio frequency (RF) power may not be supplied to the substrate processing apparatus and may not be generated uniformly during the substrate processing process. film

Method used

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Embodiment Construction

[0030] During processing in a substrate processing apparatus, the temperature of the second electrode (ie, the lower electrode) is typically higher than the temperature of the first electrode (ie, the upper electrode). Therefore, due to the temperature difference, the first electrode and the second electrode have a difference in coefficient of thermal expansion.

[0031] Before processing, a predetermined distance is maintained between the protruding electrode of the first electrode and the receptacle of the second electrode. However, due to such differences, the distance between the protruding electrodes and the jacks may not be uniform after processing. In the event of a significant difference in thermal expansion, the protruding electrodes may contact the socket, creating a short circuit.

[0032] According to the present disclosure, in order to prevent the problems described above, considering the difference in thermal expansion between the protruding electrodes of the fi...

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Abstract

The present invention relates to a substrate processing apparatus including a first electrode and a second electrode, the positions of which can be adjusted in advance in consideration of the difference of thermal expansion rates, so as to prevent, even when thermal expansion of the first electrode and the second electrode occurs during a processing procedure, the first electrode and the second electrode from being short-circuited by contacting each other. The substrate processing apparatus according to the present invention can prevent a short-circuiting between a first electrode and a second electrode even when thermal expansion of the first electrode and the second electrode occurs due to temperature rise during a processing procedure and can keep the uniformity of a thin film in a large area substrate processing apparatus.

Description

technical field [0001] The present disclosure relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus designed in consideration of differences in thermal expansion coefficients in order to prevent short circuits between electrodes. Background technique [0002] Generally, thin film layers, thin film circuit patterns, or optical patterns need to be provided on a substrate in order to manufacture semiconductor devices, flat panel displays, solar cells or photovoltaic cells, and the like. In this regard, performing substrate processing processes such as a deposition process of depositing a thin film formed of a specific material on a substrate, a photolithography process of selectively exposing a thin film using a photosensitive material, and a process of selectively removing an exposed portion of a thin film Etching process to form the pattern. [0003] Such a substrate processing process is performed using a substrate processin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32
CPCH01J37/32568H01J37/32541H01J37/3244H01L21/67H01J37/32C23C16/509C23C16/45565C23C16/45574H01L21/67098H01L21/67248H01L21/67017H01L21/67207H01J2237/036
Inventor 李栽玩金容玹金润晶金尹会朴昶均郑求贤金起范史胜晔
Owner JUSUNG ENG
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