Semiconductor circuit and manufacturing method of semiconductor circuit
A semiconductor and circuit technology, applied in the field of semiconductor circuit applications, can solve the problems of high material consumption and high cost
Pending Publication Date: 2022-02-11
GUANGDONG HIIC SEMICON LTD
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Problems solved by technology
[0003] The technical problem to be solved in the present invention is to solve the design of the mounting hole of the sealing layer of the existing semiconductor circuit. Because the mounting hole and the surrounding sealing layer are on the same plane without treatment, forming a whole, more materials are consumed, resulting in higher cost. high problem
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[0038] It should be noted that, under the condition that there is no conflict in structure or function, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below based on examples.
[0039] The semiconductor circuit mentioned in the present invention is a circuit module that integrates power switching devices and high-voltage drive circuits, and is sealed and packaged on the outside. It is widely used in the field of power electronics, such as frequency converters for driving motors, Various inverter voltage, frequency conversion speed regulation, metallurgical machinery, electric traction, frequency conversion home appliances and other fields. There are many other names for the semiconductor circuit here, such as Modular Intelligent Power System (MIPS), Intelligent Power Module (IPM), or hybrid integrated circuit, power semiconductor module, power name of the module et...
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The invention relates to a semiconductor circuit and a manufacturing method of the semiconductor circuit. The semiconductor circuit comprises a circuit substrate, an insulating layer, a plurality of electronic elements, a plurality of pins and a sealing layer. The circuit substrate comprises a mounting surface and a heat dissipation surface, the insulating layer is arranged on the mounting surface, the circuit wiring layer is arranged on the surface of the insulating layer, the circuit wiring layer is provided with a plurality of element mounting positions and bonding pads, the plurality of electronic elements are configured on the element mounting positions of the circuit wiring layer, and the plurality of pins are arranged on at least one side of the circuit substrate. The sealing layer at least wraps one surface of the circuit substrate provided with the electronic component, the other ends of the plurality of pins are exposed from the sealing layer, two ends of the sealing layer are provided with mounting holes penetrating through the thickness of the sealing layer, grooves are arranged around the mounting holes, and the sealing layer at the periphery of the mounting holes forms convex parts. Therefore, the thickness of the sealing layer at the position where the groove is formed is smaller than that of other positions, the material consumption is obviously reduced, and the purpose of saving the material of the sealing layer is achieved.
Description
technical field [0001] The invention relates to a semiconductor circuit and a method for manufacturing the semiconductor circuit, belonging to the technical field of semiconductor circuit applications. Background technique [0002] A semiconductor circuit is a power drive product that combines power electronics and integrated circuit technology. The outer surface of the semiconductor circuit is generally encapsulated by an injection-molded resin material to form a sealing layer, which seals the internal circuit board and electronic components, and the pins protrude from one or both sides of the sealing layer. The two ends of the sealing layer are generally provided with mounting holes for fixing. At present, the mounting holes and the surrounding sealing layer are on the same plane to form a whole, which consumes more materials and results in higher cost. Contents of the invention [0003] The technical problem to be solved in the present invention is to solve the design ...
Claims
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IPC IPC(8): H01L23/31H01L21/56
CPCH01L23/3107H01L21/56
Inventor 冯宇翔左安超谢荣才张土明
Owner GUANGDONG HIIC SEMICON LTD