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Light-emitting chip assembly and manufacturing method thereof, and display panel and manufacturing method thereof

A technology for light-emitting chips and manufacturing methods, which is applied to electrical components, electric solid-state devices, semiconductor devices, etc., can solve the problems of large light-emitting unit spacing, large pixel size, and low transfer yield, and achieve small size and small light-emitting unit spacing Effect

Pending Publication Date: 2022-02-11
CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the bottleneck of transfer technology in current display technology, there are problems such as large spacing between light-emitting units, large pixel size, and low transfer yield.

Method used

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  • Light-emitting chip assembly and manufacturing method thereof, and display panel and manufacturing method thereof
  • Light-emitting chip assembly and manufacturing method thereof, and display panel and manufacturing method thereof
  • Light-emitting chip assembly and manufacturing method thereof, and display panel and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment

[0062] This embodiment provides a light-emitting chip assembly. The light-emitting chip assembly includes a substrate 1 and a plurality of light-emitting unit groups. Please refer to figure 1 Each light-emitting unit group includes a buffer layer 2 disposed on the substrate 1 and at least two light-emitting units 3 formed on the buffer layer 2 .

[0063] The material of the substrate in this embodiment is a semiconductor material that can form the epitaxial layer of the light-emitting unit on the substrate. For example, the material of the substrate can be but not limited to sapphire, silicon carbide, silicon, gallium arsenide, or Other semiconductor materials are not limited here.

[0064] The light-emitting unit of this embodiment includes but is not limited to Micro-LED (Micro Light-Emitting Diode, miniature light-emitting diode) light-emitting unit, Mini-LED (Mini Light-Emitting Diode, mini-light-emitting diode) light-emitting unit, etc., formed on the substrate The light...

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Abstract

The invention relates to a light-emitting chip assembly and a manufacturing method thereof, and a display panel and a manufacturing method thereof. The light-emitting chip assembly comprises a substrate and a plurality of light-emitting unit groups, the light-emitting unit groups are arranged on the substrate, and each light-emitting unit group comprises a buffer layer arranged on the substrate and at least two light-emitting units formed on the buffer layer. Therefore, a smaller light-emitting unit interval can be formed, the size of the pixel manufactured in this way can be reduced, the transfer contact area can be increased, and the transfer yield is improved.

Description

technical field [0001] The invention relates to the field of light-emitting chip components, in particular to a light-emitting chip component and a manufacturing method thereof, a display panel and a manufacturing method thereof. Background technique [0002] Because light-emitting diodes have the advantages of energy saving, environmental protection, and long life, in the next few years, light-emitting diodes may replace traditional lighting fixtures such as incandescent lamps and fluorescent lamps, and enter thousands of households. Micro light emitting diode is a new type of display technology, which has the advantages of high brightness, low delay, long life, wide viewing angle, and high contrast. It is the current development direction of light emitting diodes. However, due to the bottleneck of transfer technology in current display technology, there are problems such as large spacing between light-emitting units, large pixel size, and low transfer yield. [0003] Ther...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/15H01L33/50H01L33/54H01L33/62
CPCH01L27/156H01L33/62H01L33/54H01L33/508
Inventor 张雪梅张柯戴广超
Owner CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD