Supercharge Your Innovation With Domain-Expert AI Agents!

Pre-injection molding type MINI LED packaging substrate

A packaging substrate and pre-injection technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of low reliability, large pixel pitch, low resolution, etc. The effect of a wide viewing angle range

Pending Publication Date: 2022-02-11
深圳市唯亮光电科技有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the problems existing in the prior art, the object of the present invention is to provide a pre-injection type MINI LED packaging substrate to solve the problems of large pixel pitch, low resolution and low reliability of the existing packaging substrate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Pre-injection molding type MINI LED packaging substrate
  • Pre-injection molding type MINI LED packaging substrate
  • Pre-injection molding type MINI LED packaging substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0044] Next, the technical solutions in the embodiments in the embodiments will be described in contemplation in conjunction with the drawings of the present invention.

[0045] See Figure 1 ~ 5 In the present invention, the pre-plastic MINI LED package substrate includes pad 1 and package line structure 2, and the pad 1 is formed by etching, and the gap of the package line structure 2 is filled with a polymer layer 3. The package line structure 2 is integrated with a plurality of pins 4, and the pad 1 is provided with a thermal post 5, and the spacing of adjacent pin 4 is less than 0.3 mm, and the package line structure 2 and the polymer layer 3 are coarse Treatment.

[0046] The flat packaging scheme is used to remove the traditional groove package design, which greatly widened the range of view, and the surface-roughened treatment process, the interface binding force of different materials is used by the specific surface area of ​​the roughness. Increased, enhanced binding powe...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a pre-injection molding type MINI LED packaging substrate, which belongs to the field of packaging substrates, and is technically characterized in that the pre-injection molding type MINI LED packaging substrate comprises a bonding pad and a packaging circuit structure, the packaging circuit structure is formed on the bonding pad through etching, a gap of the packaging circuit structure is filled with a macromolecular layer through injection molding, a plurality of pins are integrally formed on the packaging circuit structure, the bonding pad is provided with a heat conducting column, and the distance between every two adjacent pins is smaller than 0.3 mm. The multi-layer etching technology is adopted, the lead distance and the line width can be reduced to 0.07-0.1 mm, the distance of pixel points can be reduced, the resolution ratio is improved, a flat plate type packaging scheme is adopted, a traditional groove type packaging design is removed, the visual angle range is greatly widened, the surface roughening treatment process is adopted, the bonding force between the structures is enhanced, the reliability of the packaging structure is improved, and the heat dissipation capability of the packaging structure can be improved by adding the heat conducting columns made of metal.

Description

Technical field [0001] The present invention relates to the field of encapsulation substrates, and more particularly to a pre-plastic MINI LED package substrate. Background technique [0002] LED screen has a wide range of applications in indoor outdoor. All basic packages are fabricated using a traditional DIP or SMD package structure. The RGB light source chip is packaged together into a pixel point. [0003] With DIP or SMD field, larger pixel points bring a decrease in resolution, and the view angle of the package structure is small, and the interface between different materials also brings a decrease in reliability. . [0004] The traditional stent molding process is used. The encapsulation leads are large (0.3mm), and the line width is also very wide (0.3mm). The pixel point pitch is large, resulting in low resolution, and the form of a cup in the form of a box limit. Width (less than 120 degrees). Inventive content [0005] For the problems present in the prior art, the o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L27/15H01L33/54H01L33/56H01L33/62
CPCH01L27/156H01L33/62H01L33/54H01L33/56
Inventor 银光耀
Owner 深圳市唯亮光电科技有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com