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Method for removing silicone oil dirt on surface of silicon-based chip

A technology of chips and silicone oil, applied in cleaning methods and utensils, cleaning methods using liquids, chemical instruments and methods, etc., can solve problems such as inability to remove, reduce, etc.

Active Publication Date: 2022-02-18
NO 47 INST OF CHINA ELECTRONICS TECH GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The individual diced wafers stored in the nitrogen cabinet were visually inspected before use and found that there were sticky dirt on the surface, and the pollutants were observed under a 50X microscope as black particles, which were relatively dense, such as figure 1 As shown, under a 100-fold microscope, it is observed as transparent colloidal particles, such as figure 2 As shown, the use of conventional cleaning methods in the industry, such as ethanol soaking and chip brushing, has no obvious effect. After wiping the surface of the chip with ethanol cotton, the sticky dirt particles can be seen to be significantly reduced, but some particles enter the gap of the aluminum strip under pressure. cannot be removed

Method used

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  • Method for removing silicone oil dirt on surface of silicon-based chip
  • Method for removing silicone oil dirt on surface of silicon-based chip
  • Method for removing silicone oil dirt on surface of silicon-based chip

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Experimental program
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Embodiment 1

[0025] In determining the cleaning method in two models dirt chip 2 as the basis, a model chip area 2.28mm × 2.28mm, type 2 chip area 1.92mm × 1.24mm, the number of Single washes 100 ,, ultrasonic parameter set cleaning effect of the impact. Because of ultrasonic power, frequency, and ultrasound sonication time three parameters, the quadrature-phase sample large amount of data, so a method to determining a single variable parameter, and then for another two orthogonal test parameters, to determine the optimal ultrasonic cleaning parameters.

[0026] Fixed ultrasound power and ultrasonic time-invariant, the influence of changes in the frequency of Ultrasonic cleaning effect, the device maximum ultrasonic frequency 33KHz, 10% -100% adjustable parameters according to 3.3KHz step, from 3.3KHz, 6.6KHz, 9.9KHz ... ..., 29.7KHz, 33KHz, 10 parameters were set, table 2 lists the type 1 and type 2 ultrasonic frequency chip yield after cleaning (one hundred per) correspondence relationship, ...

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Abstract

The invention discloses a method for removing silicone oil dirt on the surface of a silicon-based chip, and belongs to the technical field of integrated circuit electronic packaging. According to the method, a UV film is used for fixing a chip, the chip is placed in an organic solvent isopropanol, and an ultrasonic cleaning method is used. Contrast experiments show that, when the ultrasonic power is set to be 270 W, the frequency is set to be 26.4 KHz and the cleaning time is set to be 5 min, silicone oil dirt on the surface of the chip can be removed. Tests prove that the performance and the assembling reliability of the chip are not affected after cleaning.

Description

Technical field [0001] The present invention relates to integrated circuit packaging electronic technology, particularly to a method of clearing the surface of the silicon chip of a silicone oil dirt. Background technique [0002] - the key electronic components, especially for military chip, in order to ensure its stability and reliability, in a monolithic GJB548B 2021.1 internal visual inspection method is provided that the chip 100% visual inspection of the interior before sealing the purpose of identifying potential device failure during normal use and internal defects and remove excess material. Defect comprises a metal layer defects, diffusion, and the passivation layer defects, and a chip dicing defects, a glass passivation layer defect, unwanted matter comprising a droplet on the chip, chemical stains, ink or photoresist and other movable extra material. [0003] Stored in a nitrogen cabinet zoned individual wafers prior to use internal visual inspection that the surface ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/08B08B3/12B08B13/00H01L21/02
CPCB08B3/08B08B3/12B08B13/00H01L21/02041
Inventor 周安琪田爱民任通蔡震
Owner NO 47 INST OF CHINA ELECTRONICS TECH GRP