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Full-automatic pressure curing equipment for semiconductor packaging

A curing equipment and fully automatic technology, which is applied in semiconductor/solid-state device manufacturing, lighting and heating equipment, transportation and packaging, etc., can solve problems such as uneven temperature, and achieve the effect of reasonable design and good practical application value

Active Publication Date: 2022-02-22
TAIYUAN FENGHUA INFORMATION EQUIP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a fully automatic pressure curing equipment for semiconductor packaging, the purpose is to solve the automation problem of defoaming and curing in the process of semiconductor packaging, and at the same time solve the problem of temperature inhomogeneity caused by the lengthening of the furnace body

Method used

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  • Full-automatic pressure curing equipment for semiconductor packaging
  • Full-automatic pressure curing equipment for semiconductor packaging
  • Full-automatic pressure curing equipment for semiconductor packaging

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Embodiment Construction

[0018] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0019] A fully automatic pressure curing equipment for semiconductor packaging such as figure 1 As shown, including high-temperature pressure furnace and conveying mechanism (including wafer robot, product carrier, liftable transfer roller set, feed transfer roller set, right-angle transfer machine, suspension bridge roller set, etc.).

[0020] Such as figure 2 As shown, the high-temperature pressure furnace includes a base 101, a furnace body 103 is fixedly installed on the base 101 through a rear bracket 102, and a furnace cover 105 for sealing the open end of one side of the furnace body is installed on the base 101 through a front bracket 104. A bracket 106 is slidably installed in 103, and one end of the bracket 106 is fixedly installed on the furnace cover 105, and the bracket 106 can be pulled out of the furnace body 103 by the furnac...

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Abstract

The invention discloses full-automatic pressure curing equipment for semiconductor packaging. The full-automatic pressure curing equipment comprises a high-temperature pressure furnace and a conveying mechanism, the high-temperature pressure furnace comprises a base (101), a furnace body (103) is fixedly installed on the base (101) through a rear support (102), a furnace cover (105) used for sealing the open end of one side of the furnace body is installed on the base (101) through a front support (104), a bracket (106) is installed in the furnace body (103) in a sliding mode, one end of the bracket (106) is fixedly installed on the furnace cover (105), and the bracket (106) is pulled out of the furnace body (103) through the furnace cover (105). Compared with the prior art, the automatic continuous production of the high-temperature pressure furnace is achieved, and the temperature uniformity problem of the lengthened high-temperature pressure furnace is solved by arranging the fan motor on the side face of the furnace wall.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a fully automatic pressure curing device for semiconductor packaging, which is applied to the automatic defoaming and curing of the bottom cover of the chip after filling with glue. Background technique [0002] The packaging process of semiconductors needs to be defoamed and cured in a high-temperature pressure furnace. The existing process is as follows: the product is loaded into the carrier, manually put into the high-temperature pressure furnace for defoaming and curing, and after the high-temperature pressure furnace is finished, it is manually The material is picked up and transported to the next process, with a low degree of automation. There is currently no high temperature pressure furnace for defoaming and curing automation. [0003] Disclosed in CN212205635U is a kind of positive pressure welding furnace for semiconductor packaging, its heating and ci...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F27B17/00H01L21/67H01L21/677
CPCF27B17/0025H01L21/67121H01L21/67739H01L21/67742
Inventor 胡凌骁杨子侠张君张辰星张丁赵子龙段青鹏闫旭宏
Owner TAIYUAN FENGHUA INFORMATION EQUIP
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