Two-component ceramic tile back adhesive as well as use method and preparation method thereof
A two-component, component technology, used in adhesives, epoxy resin adhesives, adhesive types, etc., can solve the problems of low bond strength, decreased bond strength, poor water resistance, etc., to achieve high bond strength, Excellent aging resistance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0045] The present invention also provides a method for preparing the two-component tile adhesive described in the above scheme, comprising the steps of:
[0046] Preparation of component A:
[0047] Mix epoxy resin, diluent, hydrophobic fumed silica, polyamide rheology modifier and filler, put the obtained first mixture into the first aerosol can, and then put dimethyl ether into the first Aerosol cans;
[0048] Preparation of component B:
[0049] Mix the curing agent, diluent, hydrophobic fumed silica, polyamide rheological additives and fillers, put the obtained second mixture into the second aerosol tank, and then put dimethyl ether into the second aerosol tank. Aerosol cans.
Embodiment 1
[0052] formula
[0053] Component A: 50 parts of modified epoxy resin, 4 parts of diluent (692), 2 parts of hydrophobic fumed silica, 0.1 part of polyamide rheology additive, 20 parts of 80 mesh glass beads, 24 parts of dimethyl ether share.
[0054] Component B: 48 parts of cyclic amine curing agent, 5 parts of diluent (benzyl alcohol), 2 parts of hydrophobic fumed silica, 1 part of polyamide rheology additive, 20 parts of 40 mesh glass beads, 25 parts of dimethyl ether share.
[0055] Preparation
[0056] Component A: Stir the modified epoxy resin and diluent in the above formula in the reactor at a speed of 20HZ for 10 minutes. After the stirring is completed, add hydrophobic fumed silica, stir at a speed of 45HZ for 30 minutes, and then The polyamide rheology modifier and the glass microspheres were stirred at a rotational speed of 20 Hz for 10 minutes to obtain a first mixture, which was put into a first aerosol can, and then dimethyl ether was filled into the can.
...
Embodiment 2
[0059] formula
[0060] Component A: 45 parts of modified epoxy resin, 8 parts of thinner (AGE), 1 part of hydrophobic fumed silica, 0.3 parts of polyamide rheology additive, 15 parts of 100-mesh quartz sand, 30 parts of dimethyl ether .
[0061] Component B: 40 parts of cyclic amine curing agent, 10 parts of diluent (benzyl alcohol), 1 part of hydrophobic fumed silica, 0.5 parts of polyamide rheology additive, 15 parts of 80-mesh quartz sand, 30 parts of dimethyl ether .
[0062] Preparation
[0063] Component A: Stir the modified epoxy resin and diluent in the above formula in the reactor at a speed of 20HZ for 10 minutes. After the stirring is completed, add hydrophobic fumed silica, stir at a speed of 45HZ for 30 minutes, and then The polyamide rheological modifier and quartz sand were stirred at a speed of 20 Hz for 10 minutes to obtain a first mixture, which was put into a first aerosol can, and then dimethyl ether was filled into the can.
[0064] Component B: Stir ...
PUM
| Property | Measurement | Unit |
|---|---|---|
| specific surface area | aaaaa | aaaaa |
| particle size | aaaaa | aaaaa |
| particle size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 
