Vacuum heating device and method
A technology of vacuum heating and heating table, applied in ohmic resistance heating devices, electric heating devices, heating elements, etc., can solve the problems of single heating method and complicated equipment cost.
Pending Publication Date: 2022-02-25
SONGSHAN LAKE MATERIALS LAB +1
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Problems solved by technology
[0004] At present, for the above-mentioned vacuum heating operation, laser heating and radio frequency heating technology are usually used, the equipment is complicated and costly, and the heating method is single
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[0045] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, not all of them. The components of the embodiments of the application generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.
[0046] Accordingly, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art w...
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The invention provides a vacuum heating device and method, and belongs to the technical field of vacuum heating. A heating table main body of the vacuum heating device comprises a sample fixing frame, a conductive base table and a first heating assembly. The conductive base table is connected with an anode wire holder; the conductive base table is provided with a positioning part used for bearing and fixing the sample fixing frame; the first heating assembly comprises a tungsten filament and tungsten filament electrodes connected to the two ends of the tungsten filament; and the tungsten filament is fixed on the conductive base table and is opposite to and not in contact with the sample fixing frame. The vacuum heating method is carried out by adopting the vacuum heating device and comprises the following steps of: heating a metal sample, specifically, connecting positive and negative electrodes of a direct-current power supply to the tungsten filament electrodes at two ends of the tungsten filament so as to make the tungsten filament carry out thermal radiation heating on the metal sample; and when the required heating temperature is higher than 600 DEG C, connecting the positive electrodeof a high-voltage power supply to the anode wire holder and connecting the negative electrode of the high-voltage power supply to the tungsten filament, so as to make electrons escape from the surface of the tungsten filament to bombard and heat the metal sample. The device is simple, is low in cost, and adopts different heating modes.
Description
technical field [0001] The present application relates to the technical field of vacuum heating, in particular, to a vacuum heating device and method. Background technique [0002] The scanning tunneling microscope, a scanning probe microscopy tool that allows scientists to observe and locate individual atoms, has a higher resolution than its atomic force microscope counterpart. In order to observe single atoms on the material surface more easily, the sample needs to be pretreated before observation, that is, the sample substrate is annealed in a high vacuum state to refine the grains, adjust the structure, and eliminate tissue defects. Thereby obtaining a clean and flat substrate. [0003] Molecular beam epitaxy is a special vacuum coating process and a new technology for preparing single crystal thin films. It is a method of growing thin films layer by layer along the crystal axis of the substrate material under appropriate substrates and conditions. By controlling the s...
Claims
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Login to View More IPC IPC(8): H05B3/00H05B3/02H05B3/06H05B3/03C30B23/06
CPCH05B3/0047H05B3/02H05B3/06H05B3/03C30B23/063
Inventor 苏君金胡建伟许智
Owner SONGSHAN LAKE MATERIALS LAB