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Workpiece supporting device, workpiece processing device, workpiece conveying device, workpiece supporting method, and workpiece processing method

A supporting device and supporting method technology, applied in the direction of grinding workpiece support, grinding device, grinding/polishing safety device, etc., can solve the problem of weak adsorption force and achieve the effect of preventing drying

Pending Publication Date: 2022-03-01
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a problem that the adsorption force of the Bernoulli suction cup becomes weaker than when compressed air is supplied

Method used

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  • Workpiece supporting device, workpiece processing device, workpiece conveying device, workpiece supporting method, and workpiece processing method
  • Workpiece supporting device, workpiece processing device, workpiece conveying device, workpiece supporting method, and workpiece processing method
  • Workpiece supporting device, workpiece processing device, workpiece conveying device, workpiece supporting method, and workpiece processing method

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Embodiment Construction

[0080] Hereinafter, embodiments of the present invention will be described with reference to the drawings. figure 1 This is an intention to show one embodiment of the polishing device 1 . figure 1 The shown polishing apparatus 1 has: a workpiece holding part 10, which holds a wafer W as an example of a workpiece, and rotates the wafer W around its axis; The polishing tape 3 of the tool is brought into contact with the first surface 2a of the wafer W held in the workpiece holder 10, thereby polishing the first surface 2a of the wafer W; and a polishing tape supply mechanism 30 which supplies the polishing tape to the polishing head 20. Grinding belt3. The polishing head 20 is an example of a processing head for processing the surface of the wafer W. As shown in FIG.

[0081] The workpiece holding unit 10 includes a plurality of rollers 11 capable of contacting the peripheral portion of the wafer W, and a plurality of workpiece support devices 12 that support the first surface...

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PUM

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Abstract

The purpose of the present invention is to provide a workpiece supporting device, a workpiece processing device, a workpiece conveying device, a workpiece supporting method, and a workpiece processing method which are capable of maintaining suction force and preventing the surface of a workpiece from drying when a Bernoulli chuck is used to support the workpiece. A workpiece support device (12) is provided with: a Bernoulli chuck (14) that generates suction force by injecting gas; and a liquid discharge member (13) that is disposed so as to surround the Bernoulli chuck (14) and discharges the liquid around the Bernoulli chuck (14).

Description

technical field [0001] The invention relates to a workpiece supporting device and a workpiece supporting method. Background technique [0002] In recent years, devices such as memory circuits, logic circuits, and image sensors (such as CMOS sensors) have become more and more highly integrated. During the process of forming these devices, foreign matter such as fine particles, dust, etc. may adhere to the devices. Foreign matter adhering to the device may cause a short circuit or a defect between wirings. Therefore, in order to improve the reliability of the device, it is necessary to clean the wafer on which the device is formed so as to remove the foreign matter on the wafer. [0003] Foreign substances such as fine particles and dust may adhere to the back surface of the wafer (non-device surface) as described above. When such foreign matter adheres to the back surface of the wafer, the wafer will be separated from the stage reference plane of the exposure device, or th...

Claims

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Application Information

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IPC IPC(8): B24B21/04B24B21/18B24B21/20B24B41/06B24B57/02H01L21/683
CPCB24B21/04B24B21/18B24B21/20B24B41/06B24B57/02H01L21/6838B24B55/06B24B41/061B24B37/345H01L21/67046B24B1/00
Inventor 柏木诚伊泽真于
Owner EBARA CORP