Unlock instant, AI-driven research and patent intelligence for your innovation.

TEC adopting ACF and preparation method thereof

A technology of anisotropic conductive adhesive and guide strip, applied in the operation mode of the machine, chemical instruments and methods, machines using electric/magnetic effects, etc. The effect of uneven conduction or damage to the internal structure and the same amount of electricity

Pending Publication Date: 2022-03-01
东莞先导先进科技有限公司
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Avoid problems such as welding surface fracture that is easy to occur in the welding process, thereby prolonging the life of the TEC

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • TEC adopting ACF and preparation method thereof
  • TEC adopting ACF and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A TEC using ACF in this embodiment, the schematic diagram of the stacked structure and the schematic diagram of the overall structure are as follows figure 1 and figure 2 shown. From top to bottom, it is composed of an upper substrate 1, a guide bar 2, an anisotropic conductive adhesive film 3, a thermocouple pair 4, an anisotropic conductive adhesive film 3, a guide bar 2 and a lower substrate 5; the anisotropic The conductive adhesive film 3 is composed of a resin binder and conductive particles, the resin binder is epoxy resin, and the conductive particles are plastic balls with a nickel-plated outer layer, and a layer of very fine resin is sprayed on the nickel-plated layer. Particle insulation.

[0030]The upper substrate and the lower substrate in this embodiment are common ceramic substrates; the thickness of the upper substrate and the lower substrate is 0.2 mm.

[0031] The current guide bar in this embodiment is made of copper conductive material; the thic...

Embodiment 2

[0036] A TEC using ACF in this embodiment has a schematic diagram of the overall structure and a schematic diagram of the laminated structure as shown in figure 1 and figure 2 shown. From top to bottom, it consists of an upper substrate 1, a guide bar 2, an anisotropic conductive adhesive film 3, a thermocouple pair 4, an anisotropic conductive adhesive film 3, a guide bar 2, and a lower substrate 5; the anisotropic The conductive adhesive film 3 is composed of a resin binder and conductive particles, the resin binder is acrylic resin, the conductive particles are plastic balls with a gold-plated outer layer, and a layer of very fine resin particles is sprayed and wrapped on the nickel-plated layer for insulation. layer.

[0037] The upper substrate and the lower substrate in this embodiment are common metal substrates; the thickness of the upper substrate and the lower substrate is 0.4mm.

[0038] The current guide bar in this embodiment is made of copper conductive mater...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

The invention belongs to the technical field of semiconductor refrigeration devices, and discloses a TEC (thermoelectric cooler) adopting ACF (anisotropic conductive film) and a preparation method of the TEC. The TEC is composed of an upper substrate, a current guide strip, an anisotropic conductive adhesive film, a thermocouple pair, an anisotropic conductive adhesive film, a current guide strip and a lower substrate from top to bottom in sequence. The anisotropic conductive adhesive film is composed of a resin adhesive and conductive particles, the conductive particles are plastic balls with the outer layers wrapped with conductive metal, and the conductive metal layer is further wrapped with an insulating layer. The preparation method comprises the following steps: uniformly coating the anisotropic conductive adhesive layers on the upper substrate and the lower substrate which comprise the diversion strips, then placing the thermocouple pair between the upper anisotropic conductive adhesive layer and the lower anisotropic conductive adhesive layer, and performing hot-pressing, laminating and curing to obtain the TEC. The TEC thermoelectric material crystal grains and the metal diversion strips are in semi-flexible connection through ACF colloid, and temperature change stress can be absorbed during cold and hot circulation. And the problems of welding surface breakage and the like easily occurring in the welding process are avoided, so that the service life of the TEC is prolonged.

Description

technical field [0001] The invention belongs to the technical field of semiconductor refrigeration devices, and in particular relates to a TEC using ACF and a preparation method thereof. Background technique [0002] TECs are used in many industries, especially in the field of temperature control. Research on new technology based on thermoelectric cooling structure. The structure of existing TEC is that the upper and lower substrates have guide strips and thermocouple pairs. Among them, welding is used to connect the thermocouple pair and the current guide strip. The disadvantages of welding are as follows: 1. The welding requires high technology; 2. The internal thermocouple pair is easy to shift during production or use, and conducts electricity with the current guide strip. Unevenness; 3. The internal structure of the welding process is rigidly connected. When working in cold and hot cycles, the variable temperature stress is likely to cause damage to the welded structur...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B32B7/12B32B18/00B32B15/20B32B15/04B32B3/08B32B33/00B32B37/12B32B37/06B32B37/10F25B21/02
CPCB32B7/12B32B18/00B32B15/20B32B15/04B32B3/08B32B33/00B32B37/12B32B37/06B32B37/10F25B21/02B32B2307/202B32B2307/206
Inventor 周雯雪谢晋毅曾广锋高涛陈玉成
Owner 东莞先导先进科技有限公司