Check ring for grinding head of chemical mechanical grinding equipment

Abstract

The invention relates to a retainer ring for a grinding head of chemical mechanical grinding equipment, which comprises a metal material ring, a retainer ring, a plurality of retainer rings and a plurality of retainer rings, and the upper surface of the metal material ring is provided with bolt holes; the plastic embedding and wrapping structures are arranged on the two side faces and the lower surface of the metal material ring, and the upper surfaces of the plastic embedding and wrapping structures are flush with the upper surface of the metal material ring; wherein the plastic embedding and wrapping structure is connected with the metal material ring through a coupling structure. According to the check ring disclosed by the invention, the use of an adhesive is eliminated, and the plastic embedding and wrapping structure is wrapped on the lower surface and the side surface of the metal material ring by utilizing a forming process, so that the problems of powder falling and stripping of the adhesive are solved, and the occurrence of scratching, sliding-out and fragment of a wafer is avoided. Besides, no plastic material exists on the upper surface of the metal material ring, so that the problem that the working surface of the check ring cannot be kept horizontal due to deformation of a plastic embedding and wrapping structure when the bolt is screwed is avoided, and the flatness of the wafer is ensured.

Description

technical field [0001] The invention relates to the technical field of semiconductor integrated circuit manufacturing equipment, in particular to a retaining ring for a grinding head of chemical mechanical grinding equipment. Background technique [0002] One of the cores of the integrated circuit industry lies in chip manufacturing, and the core of chip manufacturing lies in wafer processing. Chemical mechanical polishing is a core process in wafer processing technology. As the chip becomes more and more miniaturized, there are more and more memory layers and metal layers, and the requirements for the chemical mechanical polishing process are also getting higher and higher. [0003] Chemical Mechanical Polish (CMP) is a precision machining technology for flattening the surface of a wafer. The core part of chemical mechanical polishing equipment is the polishing head, and one of the most important components in the polishing head is the retaining ring for fixing the wafer. ...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome the shortcoming of prior art, provide a kind of retaining ring that is used for the grinding head of chemical mechanical grinding equipment, this retaining ring cancels the use of bonding agent, utilizes molding process to wrap the plastic embedding structure on metal The lower surface and sides of the material ring solve the problem of adhesive powder dropping and peeling, thus avoiding the occurrence of wafer scratches, slip-out and chipping

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