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Intelligent mobile phone integrated circuit board based on graphite film coating and preparation process

A technology for integrated circuit boards and smart phones, which is applied in the directions of multilayer circuit manufacturing, printed circuit manufacturing, and printed circuit wiring diagrams, etc. The effect of high temperature and improved stability

Pending Publication Date: 2022-03-08
JIANGSU SAIBO YUHUA TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the existing graphite film-coated smart phone integrated circuit board and its preparation process. In the process of its use, it is usually impossible to achieve stable connection and power supply, and it is impossible to achieve isolation of each layer. , prevent circuit confusion, and cannot achieve stable heat dissipation and other problems, and propose a smart phone integrated circuit board based on graphite film coating and its preparation process and installation method

Method used

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  • Intelligent mobile phone integrated circuit board based on graphite film coating and preparation process
  • Intelligent mobile phone integrated circuit board based on graphite film coating and preparation process

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Embodiment Construction

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0038] refer to Figure 1-2 , a smart phone integrated circuit board based on graphite film coating, including a support plate layer 1, a copper clad laminate layer 2 is fixed on the support plate layer 1, and an element layer 3 is fixed on the upper part of the copper clad laminate layer 2 , the lower part of the copper clad laminate layer 2 is provided with a power supply layer 5 and a signal layer 7 in sequence, the bottom of the signal layer 7 is fixed with a s...

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Abstract

The invention discloses a smartphone integrated circuit board based on a graphite film coating, which comprises a supporting plate layer, a copper-clad plate layer is fixedly arranged on the supporting plate layer, an element layer is fixedly arranged at the upper part of the copper-clad plate layer, a power supply layer and a signal layer are sequentially arranged at the lower part of the copper-clad plate layer, a substrate is fixedly arranged at the bottom of the signal layer, and a graphite film coating is arranged on the substrate. A graphite film layer is arranged at the bottom of the substrate, the power supply layer is electrically connected with the copper-clad plate layer through a first connecting column, and the copper-clad plate layer is electrically connected with the signal layer through a second connecting column; according to the integrated circuit board, isolation can be achieved by arranging the two isolation layers in the integrated circuit board, connection stability and electrification can be improved through the connecting columns and the clamping connectors, and heat dissipation treatment can be effectively conducted on the integrated circuit board through the arrangement of the heat conduction silicone grease layer and the graphite film layer.

Description

technical field [0001] The invention relates to the technical field of collecting circuit boards, in particular to a smart phone integrated circuit board based on graphite film coating and its preparation process. Background technique [0002] With more and more functions required by electronic products, the structure of PCB circuit boards is also becoming more and more complex. Due to the space limitation of PCB circuit boards, circuit boards are gradually "evolving" from single-layer to double-layer and then to multi-layer. An integrated circuit board is a carrier for carrying integrated circuits. But it is often said that the integrated circuit board also brings the integrated circuit. The integrated circuit board is mainly composed of silica gel, so it is generally green in color. The integrated circuit board uses semiconductor manufacturing technology to manufacture many transistors, resistors, capacitors and other components on a small single crystal silicon wafer, a...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/00H05K3/06H05K3/22H05K3/28H05K3/46
CPCH05K1/0298H05K1/0203H05K1/0213H05K3/0002H05K3/06H05K3/4611H05K3/28H05K3/227
Inventor 肖建军王建春冯群田涛
Owner JIANGSU SAIBO YUHUA TECH CO LTD
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