Sealing method of quartz substrate with metal electrode and special clamp thereof

Abstract

The invention discloses a sealing method of a quartz substrate with a metal electrode, which comprises the following steps of: uniformly plating glass solder on an electrode layer of the quartz substrate with the metal electrode by utilizing an evaporation method, and forming a glass solder layer; enabling the glass solder layers of the two quartz substrates to be sealed to be in contact, and applying pressure to enable the glass solder layers to be in close contact; and the pressure is kept, and high-temperature welding is conducted in a high-temperature welding furnace till welding is completed. The invention further discloses a special clamp for implementing the method. According to the invention, the sealing temperature is low, the influence of high temperature on the metal electrodes is avoided, the glass solder also has a protection effect on the metal electrodes, and meanwhile, mutual insulation between the metal electrodes is ensured.

Description

technical field [0001] The invention belongs to the technical field of non-metal welding, in particular to a method for packaging a quartz substrate plated with metal electrodes and a special fixture thereof. Background technique [0002] Quartz is a hard, wear-resistant, and chemically stable material, especially its low thermal expansion coefficient, which makes it widely used in precision instruments such as medical devices, sensors, and optoelectronic devices. In recent years, with components With the continuous miniaturization and the improvement of people's requirements for high density and high reliability of products, the sealing technology of quartz components with electrodes has become one of the important links. [0003] In many precision instruments, quartz components are not only used as structural and optical components, but also as carriers of circuits. Evaporating electrodes on quartz substrates to form circuits not only ensures stable transmission of electri...

AI Technical Summary

Problems solved by technology

Invention patent announcement number CN100538979C, the sealing of ordinary glass substrates is adopted, and the solder adopts glass solder matching the substrate, but the fusion welding method of low melting point glass as solder is not suitable for the sealing of quartz substrates, due to the thermal expansion coefficient of quartz The thermal expansion coefficient of low and low melting point glass cannot match it, and there will be large internal stress or even cracking at the interface after melting and sealing

If quartz fusion welding is used, the base metal is directly melted and then annealed and welded. Due to the high melting point of quartz (1750°C), the high temperature will destroy the electrodes on the quartz substrate.

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