A kind of gold-tin system lead-free solder and preparation method thereof

A technology of lead-free solder and solder sheet, applied in welding equipment, metal processing equipment, welding/cutting media/materials, etc., can solve problems such as processing difficulties, improve strength and plasticity, improve performance, and suppress intermetallic compounds The effect produced

Active Publication Date: 2022-03-22
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the problem of difficult processing in the gold-tin eutectic solder in the prior art, the object of the present invention is to provide a high-strength, high-plasticity gold-tin lead-free solder, which is modified by alloying and solder processing Excellent performance, good wettability, stable use, high welding strength

Method used

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  • A kind of gold-tin system lead-free solder and preparation method thereof
  • A kind of gold-tin system lead-free solder and preparation method thereof
  • A kind of gold-tin system lead-free solder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Preparation of Au-19Sn-1Ag-1In alloy:

[0030] ① Put the weighed 39.5gAu and 9.5gSn into the vacuum non-consumable arc melting furnace in proportion, turn on the circulating water, turn on the mechanical pump, and start vacuuming;

[0031] ②After the vacuum is pumped below 5Pa, turn on the molecular pump and continue to pump the vacuum to 4*10 -3 Below Pa;

[0032] ③ Open the baffle valve, close the molecular pump, and fill with argon to 0.5 atmospheres;

[0033] ④ Turn on the smelting power supply, move the W electrode to a height of 4mm from the middle titanium ingot, and strike the arc;

[0034] ⑤After the titanium ingot melts and absorbs the impurity gas, move the arc to the crucible of Au and Sn, the melting current is between 300A and smelting for 30s;

[0035] ⑥ Turn on the magnetic stirring power supply, control the stirring current between 10A, and continue melting for 60s;

[0036] ⑦Turn off the arc, and turn the ingot with a control spoon after cooling; ...

Embodiment 2

[0044] Preparation of Au-18Sn-1.5Ag-2In alloy:

[0045] ① Put the weighed 39.25gAu and 9gSn into the vacuum non-consumable arc melting furnace in proportion, turn on the circulating water, turn on the mechanical pump, and start vacuuming;

[0046] ②After the vacuum is pumped below 5Pa, turn on the molecular pump, and continue to pump the vacuum to below 4*10-3Pa;

[0047] ③Open the flapper valve, close the molecular pump, and fill with argon to 0.45 atmospheres;

[0048] ④ Turn on the smelting power supply, move the W electrode to a height of 4mm from the middle titanium ingot, and strike the arc;

[0049] ⑤After the titanium ingot melts and absorbs the impurity gas, move the arc to the crucible of Au and Sn, the melting current is between 250A and smelting for 30s;

[0050] ⑥ Turn on the magnetic stirring power supply, control the stirring current between 15A and continue melting for 60s;

[0051] ⑦Turn off the arc, and turn the ingot with a control spoon after cooling;

...

Embodiment 3

[0058] Preparation of Au-19.9Sn-0.8Ag-1.1In alloy:

[0059] ① Put the weighed 39.1gAu and 9.95gSn into the vacuum non-consumable arc melting furnace in proportion, turn on the circulating water, turn on the mechanical pump, and start vacuuming;

[0060] ②After the vacuum is pumped below 5Pa, turn on the molecular pump, and continue to pump the vacuum to below 4*10-3Pa;

[0061] ③Open the baffle valve, close the molecular pump, and fill with argon to 0.55 atmospheres;

[0062] ④ Turn on the smelting power supply, move the W electrode to a height of 4mm from the middle titanium ingot, and strike the arc;

[0063] ⑤After the titanium ingot melts and absorbs the impurity gas, move the arc to the crucible of Au and Sn, the melting current is between 280A and smelting for 30s;

[0064] ⑥ Turn on the magnetic stirring power supply, control the stirring current between 10A, and continue melting for 60s;

[0065] ⑦Turn off the arc, and turn the ingot with a control spoon after cooli...

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Abstract

The invention relates to a gold-tin-based lead-free solder and a preparation method thereof. The composition of the gold-tin-based lead-free solder is as follows in terms of mass percentage: Sn 17.9%-19.9%; Ag 0.8% ~ 1.9%; In0.8 ~ 2.7%; the balance is gold; the preparation method: melting Au and Sn together to obtain an Au-Sn master alloy, melting Ag and In together to obtain an Ag-In master alloy; then Au ‑Sn master alloy and Ag‑In master alloy are smelted together to obtain gold-tin ingots; the obtained solder has high reliability, uniform and fine structure, high strength, and good processability; it can be widely used in low-temperature packaging of electronic products and many Level packaging occasions.

Description

technical field [0001] The invention relates to the technical field of manufacturing gold-tin-based lead-free solder for low-temperature assembly in the electronics industry, and particularly designs a gold-tin-based lead-free solder and a preparation method thereof. Background technique [0002] Solder is widely used in electronic packaging, but due to the adverse impact of lead-containing solder on the ecological environment and the harm to the human body, lead-free solder has replaced lead-containing solder. Gold-tin eutectic solder has an important application in packages requiring high reliability and high airtightness due to its excellent soldering performance. [0003] However, it is difficult to solve the problems of poor plasticity and difficult processing in the existing preparation schemes, so there is an urgent need for a micro-alloyed gold-tin solder with good processing properties and its preparation method to solve the difficult processing problems in the prio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/30B23K35/40
CPCB23K35/3013B23K35/40
Inventor 马运柱陈柏杉黄宇峰唐思危刘文胜
Owner CENT SOUTH UNIV
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