43results about How to "Play a role in refinement" patented technology

The invention relates to a reverse copper foil and a preparation method thereof, a copper-clad plate and a printed circuit board. The preparation method of the reverse copper foil comprises the following steps: sequentially carrying out roughening treatment and curing treatment on one surface of an electrolytic copper foil; carrying out silanization treatment on at least one surface of the cured electrolytic copper foil to prepare a reversed copper foil; a roughening solution for roughening treatment comprises the following components in mass concentration: 10 to 15 g / L of copper ions, 100 to 110 g / L of sulfuric acid, 10 to 30 mg / L of dimethyl sulfoxide, 20 to 40 mg / L of gelatin and 50 to 80 mg / L of potassium ions; the current density of the roughening treatment is 30A / dm < 2 >-50A / dm < 2 >; a curing liquid for curing treatment comprises the following components in mass concentration: 70g / L-80g / L of copper ions, 90g / L-100g / L of sulfuric acid and 40mg / L-60mg / L of gelatin; the current density of the curing treatment is 15A / dm < 2 >-30A / dm < 2 >. The preparation method can be used for preparing the inverted copper foil with relatively low roughness and relatively high peel strength.