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Photolithographic glass and microstructure processing method thereof

A microstructure and photolithography technology, applied in glass furnace equipment, glass manufacturing equipment, manufacturing tools, etc., can solve problems such as misalignment

Pending Publication Date: 2022-03-15
CHINA BUILDING MATERIALS ACAD
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  • Claims
  • Application Information

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Problems solved by technology

[0012] The purpose of the present invention is to aim at the technical problems existing in the existing lithographic glass and microstructure processing technology, optimize the glass composition, improve its mechanical properties and thermodynamic properties, optimize the processing technology, and reduce the glass produced in the heat treatment process. Deformation, solving problems such as misalignment of glass vias

Method used

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  • Photolithographic glass and microstructure processing method thereof
  • Photolithographic glass and microstructure processing method thereof

Examples

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Embodiment 1-8

[0056] Examples 1-8 are examples of photolithographic glass of the present invention, wherein Examples 1-4 respectively adopt the glass raw material formulas a-d shown in Table 1, and are prepared by the following preparation method 1, and the prepared glasses have the following properties: Components a-d shown in Table 2; Examples 5-8 were prepared using the glass raw material formulas a-d shown in Table 1, respectively, using the following preparation method 2.

[0057] Table 1 shows the raw material formulations of the photoresistable glasses described in Examples 1-8 of the present invention.

[0058] Table 2 shows the composition of the photoresistable glasses described in Examples 1-4 of the present invention.

[0059] The raw material formula of the photoetching glass of table 1 embodiment 1-8

[0060]

[0061] The composition of the photoetching glass of table 2 embodiment 1-4

[0062] parts by mass Component a Component b component c component d...

Embodiment 9

[0082] This embodiment provides a photolithography method for photolithographic glass wafers, which can realize high-quality processing of glass surfaces. The steps are as follows:

[0083] (1) The lithographic glass of Example 2 is optically processed to obtain a plurality of glass wafers with diameters of 2, 3, and 4 inches respectively, and the glass wafers of each diameter are respectively processed to have 200 μm, 300 μm, Multiple glass wafers with thickness of 400μm and 500μm;

[0084] (2) Use a quartz reticle with an aperture of 50 μm and a spacing of 100 μm to expose each glass wafer to ultraviolet light at an exposure wavelength of 316 nm and an energy density of 3.5 W / cm 2 , for the glass wafer exposure, the relationship between the exposure time and the thickness of the glass wafer is as follows: a glass wafer with a thickness of 200 μm was exposed for 15 minutes, a glass wafer with a thickness of 300 μm was exposed for 20 minutes, a glass wafer with a thickness of ...

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Abstract

The invention provides photoetching glass and a microstructure processing method thereof. The glass capable of being photoetched is prepared from the following components in parts by mass: 75 to 79 parts of SiO2, 7 to 11 parts of Li2O, 3 to 4.5 parts of Al2O3, 3 to 6 parts of B2O3, 2 to 3 parts of K2O and KBr, 1 to 2.5 parts of Na2O, 1 to 1.2 parts of ZnO, 0.02 part of Sb2O3, 0.01 to 0.1 part of Ce2O3 and 0.1 to 0.15 part of Ag2O. According to the photolithographic glass provided by the invention, by optimizing glass components and a melting process, the uniformity and hot working performance of a glass material are improved, and the uniformity of deformation of the glass material in a temperature field is improved.

Description

technical field [0001] The invention relates to the field of glass, in particular to a photoetching glass and a glass microstructure processing method. Background technique [0002] Photoetching glass is a glass material that has developed rapidly in recent years and has shown great potential in the field of microelectronics integration technology. The microstructure device prepared by photoetching glass has good dielectric properties, thermodynamic properties and processability. In particular, the glass interposer, used for high-density integration of chips, can solve many technical difficulties of the integrated architecture, such as high consistency of high-precision planar integration, low dielectric loss of high-frequency transmission, compatibility with advanced packaging technology and high Vertical integration of density. [0003] In recent years, related patent applications for photosensitive glass / photoetching glass have gradually increased, mainly concentrated i...

Claims

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Application Information

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IPC IPC(8): C03C3/11C03B25/02C03B5/187C03B5/16C03C15/00
CPCC03C3/11C03B5/16C03B5/187C03B25/02C03C15/00
Inventor 朱永昌韩勖王佳佳关铭张海潮于雷
Owner CHINA BUILDING MATERIALS ACAD
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