Film probe card and probe head thereof

A probe card and probe head technology, which is applied in the direction of measuring devices, instruments, and measuring electronics, can solve problems such as unevenness and easy damage of the film, and achieve the effect of preventing excessive contact force and stable and reliable electrical contact
CN114200280AActive Publication Date: 2022-03-18MAXONE SEMICON CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
MAXONE SEMICON CO LTD
Publication Date
2022-03-18

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Abstract

The invention relates to a film probe card and a probe head thereof, the film probe card comprises a film probe head (3), the film probe head (3) comprises a support body (31), a film (32), a probe (33) and an interconnection line (34); a concave supporting structure (35) is arranged between the acting surface (311) of the supporting body (31) and the thin film (32), the concave supporting structure (35) comprises a concave structure (351) and a supporting elastic layer (352), the concave structure (351) comprises one or more concave parts (3511), the positions of the concave parts (3511) correspond to those of the probes (33), and each concave part (3511) is eccentric to the corresponding probe (33); the protruding embedded blocks (3521) of the supporting elastic layer (352) are embedded into the corresponding recesses (3511), so that the portions, located on the two sides of each probe (33), of the supporting elastic layer (352) have a thickness difference.
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Description

technical field

[0001] The invention belongs to the technical field of probe cards and wafer testing, and in particular relates to a film probe card and a probe head thereof. Background technique

[0002] In recent years, with the development and popularization of 5G technology and consumer electronics technology, semiconductor devices continue to develop towards miniaturization, integration, and dense pad spacing, and the operating frequency continues to increase. Wafer-level testing for high frequencies has gradually become an RF An unobtainable and important part of chip production. Compared with other types of probe cards, the thin-film probe card realizes small-scale probe structure processing and high-precision signal line structure parameter control, reduces the generation of parasitic capacitance and inductance, greatly shortens the signal path, and improves The degree of impedance matching is widely used in high-frequency wafer-level test analysis.

[0003] During...

Claims

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