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Film probe card and probe head thereof

A probe card and probe head technology, which is applied in the direction of measuring devices, instruments, and measuring electronics, can solve problems such as unevenness and easy damage of the film, and achieve the effect of preventing excessive contact force and stable and reliable electrical contact

Active Publication Date: 2022-03-18
MAXONE SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A significant disadvantage of this method is that the measured slip of the probe is related to the position of the probe relative to the center of the film, which is not uniform.
[0007]In the prior art, the most representative structure can be found in US Patent No. 7,893,704, which proposes a new thin-film probe structure, which is a probe design For a cantilever-like structure, the measurement of slippage is achieved by using the cantilever-like probe structure to rotate around the end of the cantilever during the test. However, in this way, the probe needs to repeatedly rotate around the end of the cantilever, and the stress is concentrated here. The film is easily damaged

Method used

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  • Film probe card and probe head thereof
  • Film probe card and probe head thereof
  • Film probe card and probe head thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Embodiment one: see attached Figure 1-6 Shown:

[0049] A thin-film probe card, comprising a PCB board 1, a connector 2, and a thin-film probe head 3; The thin film 32 , and the probes 33 and interconnection lines 34 arranged on the thin film 32 .

[0050] PCB board 1 is a multi-layer epoxy resin circuit board, on which coaxial connectors 11 and signal connection points 12 are distributed, and PCB traces 13 are distributed inside, respectively connecting coaxial connectors 11 to corresponding signal connection points 12, Realize electrical signal conduction and transmission; the surface of PCB 1 is also distributed with spring structures 14 and PCB end threaded holes 15; the center of PCB 1 is hollowed out to accommodate the film probe head 3; spring structure 14 is located in the center of PCB 1 The outer periphery of the hollowed out part is used to realize the tight connection with the film probe head 3 .

[0051] The supporting body 31 is a rigid body with a con...

Embodiment 2

[0062] Embodiment two: see attached Figure 1-6 Shown:

[0063] A film probe head, including a support body 31 providing an action surface 311, a film 32 covering the action surface 311 of the support body 31, and probes 33 and interconnection wires 34 arranged on the film 32, specifically The structure is the same as that of the thin-film probe head in Embodiment 1, and will not be repeated here.

Embodiment 3

[0064] Embodiment three: see attached figure 1 , attached figure 2 , attached Figure 7 and attached Figure 8 Shown:

[0065] A thin-film probe card, comprising a PCB board 1, a connector 2, and a thin-film probe head 3; The thin film 32 , and the probes 33 and interconnection lines 34 arranged on the thin film 32 .

[0066] The difference from Embodiment 1 is that the probes 33 are in a straight line, and the depression 3511 is not a groove, but half of the supporting rigid body 353 is concave upward, that is, the supporting rigid body 353 is half thick and half thin. The thinner side forms the recess 3511, such as Figure 7 , and a column of probes 33 is correspondingly arranged across the wall of the recess 3511, such as Figure 8 shown. The shape of the supporting elastic layer 352 is matched with the lower surface of the supporting rigid body 353, so that the parts on both sides of the probe 33 on the supporting elastic layer 352 have a thickness difference, so t...

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Abstract

The invention relates to a film probe card and a probe head thereof, the film probe card comprises a film probe head (3), the film probe head (3) comprises a support body (31), a film (32), a probe (33) and an interconnection line (34); a concave supporting structure (35) is arranged between the acting surface (311) of the supporting body (31) and the thin film (32), the concave supporting structure (35) comprises a concave structure (351) and a supporting elastic layer (352), the concave structure (351) comprises one or more concave parts (3511), the positions of the concave parts (3511) correspond to those of the probes (33), and each concave part (3511) is eccentric to the corresponding probe (33); the protruding embedded blocks (3521) of the supporting elastic layer (352) are embedded into the corresponding recesses (3511), so that the portions, located on the two sides of each probe (33), of the supporting elastic layer (352) have a thickness difference.

Description

technical field [0001] The invention belongs to the technical field of probe cards and wafer testing, and in particular relates to a film probe card and a probe head thereof. Background technique [0002] In recent years, with the development and popularization of 5G technology and consumer electronics technology, semiconductor devices continue to develop towards miniaturization, integration, and dense pad spacing, and the operating frequency continues to increase. Wafer-level testing for high frequencies has gradually become an RF An unobtainable and important part of chip production. Compared with other types of probe cards, the thin-film probe card realizes small-scale probe structure processing and high-precision signal line structure parameter control, reduces the generation of parasitic capacitance and inductance, greatly shortens the signal path, and improves The degree of impedance matching is widely used in high-frequency wafer-level test analysis. [0003] During...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26G01R1/073
CPCG01R31/26G01R1/073G01R1/0735G01R31/2891G01R1/06716G01R1/07342
Inventor 赵梁玉于海超王艾琳
Owner MAXONE SEMICON CO LTD
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