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Efficient thick copper plate solder resist printing method

A thick copper plate and solder mask technology, applied in the secondary treatment, application, coating of non-metallic protective layers of printed circuits, etc., can solve the problems of poor high temperature resistance, easy to explode, etc., and achieve fast curing speed and good curing performance. , the effect of excellent heat resistance

Active Publication Date: 2022-03-18
BAIQIANG ELECTRONICS SHENZHEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the printed circuit boards in the prior art are prone to cracks after baking, and have defects such as poor high temperature resistance.

Method used

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  • Efficient thick copper plate solder resist printing method
  • Efficient thick copper plate solder resist printing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] A process for preparing a solder mask for a thick copper plate, comprising the following steps:

[0044] (1) Make a copper layer area screen for the area covered by the copper layer on the surface of the circuit board;

[0045] (2) Cover the copper layer area screen on the thick copper plate treated with volcanic ash, perform screen printing once with the diluted solder resist ink, let it stand for 28 minutes, and then place it at 75 ° C to dry for 50 minutes to obtain a thick copper plate for one printing;

[0046] (3) peel off the copper layer area screen on the thick copper plate obtained in step (2), then use undiluted solder resist ink for secondary printing, let stand for 28 minutes, and finally, place it at 75 ° C to dry for 50 minutes, Obtain secondary printing thick copper plate;

[0047] (4) Expose, develop, and solidify the thick copper plate for secondary printing obtained in step (3) at high temperature to obtain a thick copper plate for solder resist, whe...

Embodiment 2

[0050] A process for preparing a solder mask for a thick copper plate, comprising the following steps:

[0051] (1) Make a copper layer area screen for the area covered by the copper layer on the surface of the circuit board;

[0052] (2) Cover the copper layer area screen on the thick copper plate treated with volcanic ash, then immerse it in the etchant horizontally for 40s, then slowly lift it out, place it on the plane and ultrasonic for 15min, the ultrasonic power is 140W, and the ultrasonic frequency is 15kHz, then, scrape off the excess etchant, let it stand for 15min, and dry it at 75°C for 28min to obtain a etched thick copper plate;

[0053] (3) screen printing the etch-repair thick copper plate obtained in step (2) with the diluted solder resist ink, let stand for 28 minutes, and then place it at 75° C. to dry for 50 minutes to obtain a printing thick copper plate;

[0054] (4) peel off the copper layer area screen on the thick copper plate obtained in step (3), th...

Embodiment 3

[0060] A process for preparing a solder mask for a thick copper plate, comprising the following steps:

[0061] (1) Make a copper layer area screen for the area covered by the copper layer on the surface of the circuit board;

[0062] (2) Cover the copper layer area screen on the thick copper plate treated with volcanic ash, then immerse it in the etchant horizontally for 40s, then slowly lift it out, place it on the plane and ultrasonic for 15min, the ultrasonic power is 140W, and the ultrasonic frequency is 15kHz, then, scrape off the excess etchant, let it stand for 15min, and dry it at 75°C for 28min to obtain a etched thick copper plate;

[0063] (3) screen printing the etch-repair thick copper plate obtained in step (2) with the diluted solder resist ink, let stand for 28 minutes, and then place it at 75° C. to dry for 50 minutes to obtain a printing thick copper plate;

[0064] (4) peel off the copper layer area screen on the thick copper plate obtained in step (3), th...

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Abstract

The invention discloses an efficient thick copper plate solder resist printing method. Ink adopted in the high-efficiency thick copper plate solder resist printing method mainly comprises the following raw materials by mass: 3, 4-epoxy cyclohexyl methyl methacrylate, amido resin, titanium dioxide, 3-methacryloyloxy propyl trimethoxy silane, propylene glycol methyl ether acetate and 2, 4, 6-trimethylbenzoyl phenyl ethyl phosphonate, and all the substances interact with one another, so that the ink can be used for preparing the high-efficiency thick copper plate solder resist printing ink. The ink has the advantages of favorable curing property, favorable adhesive force, excellent heat resistance, excellent weather resistance and high curing speed.

Description

technical field [0001] The invention relates to the field of solder resist, in particular to a method for printing a high-efficiency thick copper plate for solder resist. Background technique [0002] The application field and demand of thick copper plate have expanded rapidly in recent years, and it has become a type of "hot" printed circuit board (PCB) with good market development prospects; the vast majority of thick copper plates are high-current substrates. The main application areas of high-current substrates are two major areas: power modules (power modules) and automotive electronic components. Some of its main terminal electronic products are the same as conventional PCBs (such as portable electronic products, network products, base station equipment, etc.), and some are different from conventional PCB fields, such as automobiles, industrial control, power modules, etc. [0003] In the process of solder resist of thick copper plate, the solder resist ink is coated ...

Claims

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Application Information

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IPC IPC(8): H05K3/28C09D11/101C09D11/03C09D11/0235C08L63/00C08K9/06C08K9/04C08K3/36C08K5/05C08G59/20
CPCH05K3/28C09D11/101C09D11/03C09D11/0235C08K9/06C08K9/08C08K3/36C08K5/05C08G59/20C08L63/00
Inventor 徐巧丹柯木真陈文德刘涛卢海航
Owner BAIQIANG ELECTRONICS SHENZHEN
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