A high-efficiency thick copper plate solder mask printing method

Abstract

The invention discloses a high-efficiency thick copper plate solder resist printing method. The ink used in the high-efficiency thick copper plate solder mask printing method is mainly composed of the following quality raw materials: 3,4-epoxycyclohexyl methacrylate, amide resin, titanium dioxide, 3-methacryloyloxypropyl Trimethoxysilane, propylene glycol methyl ether acetate, 2,4,6-trimethylbenzoyl phenylphosphonate ethyl ester, the interaction between these substances makes the ink have good curing performance, adhesion, and excellent Excellent heat resistance, weather resistance, and fast curing speed.

Description

technical field

[0001] The invention relates to the field of solder resist, in particular to a method for printing a high-efficiency thick copper plate for solder resist. Background technique

[0002] The application field and demand of thick copper plate have expanded rapidly in recent years, and it has become a type of "hot" printed circuit board (PCB) with good market development prospects; the vast majority of thick copper plates are high-current substrates. The main application areas of high-current substrates are two major areas: power modules (power modules) and automotive electronic components. Some of its main terminal electronic products are the same as conventional PCBs (such as portable electronic products, network products, base station equipment, etc.), and some are different from conventional PCB fields, such as automobiles, industrial control, power modules, etc.

[0003] In the process of solder resist of thick copper plate, the solder resist ink is coated ...