Low-mutual-diffusion and high-temperature-oxidation-resistant coating for copper conductor and preparation method thereof

A technology of anti-high temperature oxidation and copper conductor, which is applied in the direction of coating, metal material coating process, ion implantation plating, etc., can solve the problems of insufficient copper conductor oxidation resistance, coating interdiffusion, low interdiffusion, etc. The process is green and pollution-free, the process is simple, and the effect of efficient preparation

Pending Publication Date: 2022-03-25
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problem of insufficient anti-oxidation of copper conductors in advanced power equipment and easy interdiffusion with coatings leading to performance deterioration, and specifically provides a low interdiffusion, high temperature oxidation-resistant coating for copper conductors and its preparation method

Method used

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  • Low-mutual-diffusion and high-temperature-oxidation-resistant coating for copper conductor and preparation method thereof
  • Low-mutual-diffusion and high-temperature-oxidation-resistant coating for copper conductor and preparation method thereof
  • Low-mutual-diffusion and high-temperature-oxidation-resistant coating for copper conductor and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] This example illustrates the preparation of low interdiffusion and high temperature oxidation resistant coatings for copper conductors by multi-arc ion plating and its preparation method. First, install the pure chromium target on the cathode water-cooled target sleeve, hang the copper sheet substrate in front of the target, close the vacuum chamber door, and carry out pumping; the vacuum degree of the back of the chamber reaches 10 -3 When Pa level or lower, open the pressure valve to feed Ar gas into the vacuum chamber to maintain the vacuum at 2-3Pa, set the bias voltage in the range of -700V--1000V, and perform glow cleaning on the substrate surface for about 10 minutes. Then close the pressure valve to maintain the vacuum at 10 -3 Pa; The cathodic arc is directly ignited by the arc pilot by the contact method. In this example, the arc current is 200A, the pulse bias voltage is -100V, the duty cycle is 20%, and the time is 20min. The surface and cross-sectional sc...

Embodiment 2

[0034] This example illustrates the preparation of low interdiffusion and high temperature oxidation resistant coatings for copper conductors by multi-arc ion plating and its preparation method. First, install the pure chromium target on the cathode water-cooled target sleeve, hang the copper parts in front of the target, close the vacuum chamber door, and pump air; the vacuum degree of the back of the chamber reaches 10 -3 At Pa level or lower, open the pressure valve and inject Ar gas into the vacuum chamber to maintain the vacuum at 2 to 5 Pa, set the bias voltage in the range of -700V to -1000V, and perform glow ion etching on the surface of the substrate for 10 minutes Then turn off the Ar gas, feed nitrogen to maintain the vacuum at 0.1-0.5 Pa; use the contact method to directly ignite the cathode arc from the arc needle. In this example, the arc current is 150A, the pulse bias voltage is -80V, the duty cycle is 40%, and the time is 30min. Thus a Cr-N coating is obtaine...

Embodiment 3

[0037] This example illustrates the low interdiffusion and anti-high temperature oxidation multi-component coating for copper conductors prepared by multi-arc ion plating and its preparation method. First, install the chromium alloy target on the cathode water-cooled target sleeve. The chromium alloy target contains one or a combination of Al, Ni, Ag, Si, Fe, Ti, Zr, and its total content is 0-50% of the atomic ratio. Hang the copper piece in front of the target, close the door of the vacuum chamber, and pump air; the vacuum degree of the back of the chamber reaches 10 -3 At Pa level or lower, open the pressure valve and inject Ar gas into the vacuum chamber to maintain the vacuum at 2-5Pa, set the bias voltage in the range of -500V--700V, and perform glow ion etching on the surface of the substrate for 2 minutes Then close the Ar gas and use the contact method to ignite the cathode arc directly from the arc needle. In this example, the arc current is 200A, the pulse bias vol...

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Abstract

A low-interdiffusion and high-temperature-oxidation-resistant coating for a copper conductor is characterized in that the chemical component of the low-interdiffusion and high-temperature-oxidation-resistant coating for the copper conductor is pure chromium or chromium alloy with the chromium atom percentage not lower than 95%, and the organization structure of the low-interdiffusion and high-temperature-oxidation-resistant coating is a single-layer or multi-layer fine grain organization with single preferred orientation. The preparation method of the low-mutual-diffusion high-temperature-oxidation-resistant coating for the copper conductor is carried out in vacuum, and the coating is deposited on the surface of a part through a chromium ion flow bombardment method with the density not lower than 4.6 * 10 < 20 > m <-2 > s <-1 > and the charge energy ranging from 90 eV to 900 eV. The method has the advantages that the problem of serious oxidation of the copper conductor during high-temperature application is solved, and the problem that the conductivity is reduced due to coating / matrix mutual diffusion when other high-temperature protective coatings are applied to the copper conductor is solved. Various chromium-based coatings can be efficiently prepared, the technological process is green and free of pollution, and the method is suitable for coating preparation of various copper conductor products such as blocky parts and copper wires.

Description

technical field [0001] The invention relates to the technical field of protective coatings, in particular to a low interdiffusion and high-temperature oxidation-resistant coating for copper conductors and a preparation method thereof. Background technique [0002] Copper and copper alloys have low resistivity, good thermal conductivity, and excellent processing performance, and are widely used in power transmission, motors, coils, microelectronic connections, and rail transit. However, copper is easily oxidized in high-temperature air (>200°C), and the formed oxide film is not protective, and the oxidation rate is relatively high. Its application in the field of high temperature conductivity. At present, advanced power equipment has an increasing demand for high-temperature power transmission and electromagnetic coils. How to improve the oxidation resistance of copper conductors and ensure their stable high-temperature electrical conductivity is an urgent problem to be s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/32C23C14/16C23C14/58
CPCC23C14/325C23C14/16C23C14/5806
Inventor 沈明礼武姣姣朱圣龙
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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