Novel heat-conducting glue-pouring aluminum substrate and manufacturing method thereof

Abstract

The novel heat-conducting glue-pouring aluminum substrate comprises an aluminum bottom plate, an insulating heat-conducting layer is arranged at the upper end of the aluminum bottom plate, a copper foil is arranged at the upper end of the insulating heat-conducting layer, and the upper end of the copper foil is coated with an anti-oxidation layer. The upper end of the aluminum bottom plate, the upper end of the insulating heat conduction layer, the upper end of the copper foil and the upper end of the anti-oxidation layer are jointly provided with four vertically-through mounting holes, a plurality of protruding blocks are fixedly connected to the middle of the upper end of the anti-oxidation layer, heat conduction silica gel is arranged on the lower inner wall faces of the protruding blocks, and conductive chips are arranged at the upper ends of the heat conduction silica gel. The aluminum substrate has good thermal conductivity, and compared with a traditional copper bottom plate and ceramic chip process, the aluminum substrate can reduce the thermal resistance to the minimum; the insulation effect of the aluminum substrate is very good, the withstand voltage can reach 4500V, and the most obvious difference between the aluminum substrate and the traditional ceramic chip is that the ceramic chip is fragile, so that the aluminum substrate not only ensures insulation, but also can improve the mechanical durability of the module in use.

Description

technical field [0001] The invention belongs to the technical field of aluminum substrates, in particular to a novel heat-conducting glue-filled aluminum substrate and a manufacturing method thereof. Background technique [0002] The aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided panel consists of a three-layer structure, which is a circuit layer (copper foil), an insulating layer and a metal base layer. Commonly found in LED lighting products. There are two sides, the white side is for soldering the LED pins, and the other side shows the natural color of aluminum, which is usually coated with heat-conducting gel and then in contact with the heat-conducting part. There are also ceramic substrates and so on. For high-end use, it is also designed as a double-sided board, and the structure is a circuit layer, an insulating layer, an aluminum base, an insulating layer, and a circuit layer. Very few appli...

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Problems solved by technology

[0003] However, the existing aluminum substrates still have the following deficiencies: with the rapid development of electronics and electrical technology and the concept of energy saving and environmental protection, LED technology has been vigorously developed, and the requirements for heat dissipation performance of component circuit boards have also increased. It is gradually improving. Therefore, some copper-based circuit boards and ceramic-based circuit boards with high heat dissipation are welcomed in the market. On the one hand, it can play the role of heat conduction, on the other hand, it can also play the role of insulation, but the copper base plate has high thermal resistance and poor heat dissipation effect, and the ceramic substrate is used on the formed aluminum nitride or aluminum nitride ceramics, using a special process It is made by directly plating a layer of copper on it, and the use of a ceramic substrate may easily cause the ceramic chip to break and thus cannot be used normally; in addition, the current substrate has the defect of poor heat dissipation

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