Liquid microcapsule curing device and method based on infrared heating

A technology of microcapsule curing and infrared heating, applied in packaging and other directions, can solve the problems of low curing efficiency, irregular shape, cumbersome process, etc., and achieve the effect of uniform morphology

Active Publication Date: 2022-04-12
JIANGNAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, there are three problems in the existing solidification method of liquid microcapsules: first, the contents of microcapsules are mostly solid particles, and there is a lack of microcapsule preparation and solidification devices whose contents are liquid; secondly, the material of the liquid microcapsule shell Using gelatin and cold curing method, the curing efficiency is low; third, the shape of the liquid microcapsules cannot be controlled, and it is easily affected by external

Method used

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  • Liquid microcapsule curing device and method based on infrared heating
  • Liquid microcapsule curing device and method based on infrared heating
  • Liquid microcapsule curing device and method based on infrared heating

Examples

Experimental program
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Effect test

Embodiment 1

[0055] A liquid microcapsule curing device based on infrared heating, such as figure 1 As shown, the device includes: a coaxial dropper 1, a curing cavity 2 and an iron stand 8; the iron stand 8 is connected with a dropper clamp 83 and a curing cavity support clamp 82 through a vertical rod; the dropper Clip 83 is used to clamp the coaxial drip tube 1, and the curing cavity support clip 82 is used to clamp the curing cavity 2; the coaxial drip tube 1 and the curing cavity 2 The central axis coincides; the coaxial drip tube 1 extends into the curing cavity 2 from the opening at the top center of the curing cavity 2; the bottom center of the curing cavity 2 is provided with a discharge pipeline 3; the discharge pipeline 3 is provided with a discharge valve 6; the end of the discharge pipeline 3 is provided with a discharge port 7; the upper part of the curing cavity 2 is an inverted conical cavity with a hyperbolic section body, the top of the inverted tapered cavity of the cur...

Embodiment 2

[0073] This embodiment provides a liquid microcapsule curing method based on infrared heating, the method is applied to the liquid microcapsule curing device described in this method, and it is characterized in that the method includes the following steps:

[0074] Step 1: After fixing the coaxial dropper 1 and the curing cavity 2 respectively by using the dropper support clip 83 and the solidification cavity support clip 82 on the iron stand 8, close the unloading valve 6 and open the discharge valve 3 on the discharge pipe 3 A plurality of secondary air intake ducts 31 feed dry air into the device;

[0075] Step 2: The coaxial dropper 1 produces microcapsules 13, and when the microcapsules fall from the coaxial dropper 1 into the curing cavity 2 and pass through the first position sensor 221, a plurality of main air intake pipes are opened 32 and a plurality of infrared heating modules 21, the updraft generated by a plurality of main air intake ducts 32 prolongs the residenc...

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Abstract

The invention discloses a liquid microcapsule curing device and method based on infrared heating. The device comprises a coaxial flow dropper (1), a curing cavity (2) and an iron support (8). The iron stand (8) is connected with a dropper clamp (83) used for clamping the coaxial flow dropper (1) and a curing cavity supporting clamp (82) used for clamping the curing cavity (2). The coaxial flow dropper (1) extends into the curing cavity (2) from the top of the curing cavity (2); a discharging pipeline (3) is arranged at the bottom of the curing cavity (2); a discharge valve (6) is arranged on the discharge pipeline (3), and a discharge port (7) is formed in the tail end of the discharge pipeline (3); the upper part of the curing cavity (2) is an inverted conical cavity with a hyperbolic cross section, and an exhaust port (23) is formed in the top of the curing cavity (2); the lower portion of the curing cavity (2) is a spherical cavity, a plurality of infrared heating modules (21) are evenly arranged on the inner surface of the cavity, and each infrared heating module is composed of an infrared metal heating belt, a PET insulating layer and a temperature control element.

Description

technical field [0001] The invention relates to a liquid microcapsule curing device and method based on infrared heating, and belongs to the technical field of microparticle preparation. Background technique [0002] Microcapsule technology is a technology that wraps trace substances in polymer films, and is a micro-packaging technology for storing solids, liquids, and gases. Specifically, microcapsule technology refers to completely covering a target object (core material or inner phase) with various natural or synthetic polymer compound continuous films (wall material or outer phase), and The original chemical properties are not damaged at all, and then the function of the target object is displayed again through some external stimulation or slow release, or the core material is protected by the shielding effect of the shell wall material of the microcapsule. [0003] The solidification of the shell of the liquid microcapsule can protect the wrapped material and isolate i...

Claims

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Application Information

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IPC IPC(8): B65B7/16
Inventor 俞建峰黄然夏晓露刘锐王逸涵廖一秦天方成缘化春键蒋毅
Owner JIANGNAN UNIV
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