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Probe card integrating different electrical tests

A technology of electrical testing and probe cards, which is applied in the field of probe cards, can solve problems such as difficulty in meeting probe length specifications, deterioration of contact resistance values, and difficult control of needle tip positions, so as to improve the deterioration of contact resistance values, The effect of improving efficiency and speeding up testing

Pending Publication Date: 2022-04-15
MICROELECTRONICS TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the technology teaches to integrate two kinds of probes, generally speaking, the probes have a depth specification, counting from the lower edge of the PCB circuit substrate, and there are also length requirements for the RF probes used in the technology, which makes it difficult to meet The problem with the length specification of the probe
In addition, because the assembly method of the RF probe will make the length of the probe part longer, once the RF probe becomes longer, the position of the needle tip will be difficult to control, and the contact resistance between the RF probe and the object under test will also change. bad question

Method used

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  • Probe card integrating different electrical tests
  • Probe card integrating different electrical tests
  • Probe card integrating different electrical tests

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Embodiment Construction

[0042] Various exemplary embodiments will be described more fully hereinafter with reference to the accompanying drawings, in which some exemplary embodiments are shown. However, inventive concepts may be embodied in many different forms and should not be construed as limited to the illustrative embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. Like numbers indicate like elements throughout. The probe card integrating different electrical tests of the present invention will be described below with various embodiments and drawings. However, the following embodiments are not intended to limit the present invention.

[0043] see Figure 1A and Figure 1B shown, where Figure 1A It is a three-dimensional exploded schematic diagram of an embodiment of the probe card of the present invention, Figure 1B It is a s...

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Abstract

The invention relates to a probe card integrating different electrical property tests, which is used for testing the electrical property of an object to be tested and comprises a plurality of probes and a probe seat. The plurality of probes includes at least one impedance matching probe and a plurality of cantilever probes. The probe seat comprises a circuit substrate and a fixed substrate. The circuit substrate is provided with a first through hole. The fixed substrate has a second through hole. The fixed substrate is arranged on the circuit substrate, the second through hole corresponds to the first through hole, the aperture of the first through hole is larger than that of the second through hole, at least one impedance matching probe penetrates through the first through hole and is arranged on the fixed substrate, and the probe part of each impedance matching probe penetrates through the second through hole; one end of the cantilever section of each cantilever probe is electrically connected with the circuit substrate, the other end of the cantilever section of each cantilever probe is connected with the tip section of the corresponding cantilever probe, and the tip section of each cantilever probe is arranged on the to-be-detected object side of the second through hole.

Description

technical field [0001] The invention relates to a probe card, in particular to a probe card with layouts of impedance matching probes and cantilever probes for performing different electrical tests on objects to be tested. Background technique [0002] Due to the miniaturization of electronic components, it is necessary to test whether there is any problem with signal transmission after the semiconductor manufacturing process to determine the quality of electronic components. Generally speaking, to test whether the electrical connection between the various electronic components in an electronic product is correct, or whether there is a problem with signal transmission, the probe card is usually used as the test interface between the test device and the electronic device to be tested. Transmission and electrical signal analysis to obtain test results of the electronic device under test. [0003] With the improvement of communication technology, the existing probe card tests ...

Claims

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Application Information

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IPC IPC(8): G01R1/073
Inventor 蔡锦溢张嘉泰苏正年杨金田余陈志
Owner MICROELECTRONICS TECH INC