External thermal insulation device of semiconductor heater

A heating device and semiconductor technology, applied to heating elements, ohmic resistance heating parts, etc., can solve the problems of large space area, inconvenient disassembly and transportation, etc., and achieve the effect of reducing space occupation, facilitating long-distance transportation and stable movement

Pending Publication Date: 2022-04-15
芜湖尼晶电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In today's existing external heat preservation devices for semiconductor heaters, for example, in the technical structure of the application document CN202020301201.6, an electric heater and a bottom plate are included. The outer side of the electric heater is provided with a heat preservation cover. The first insulation cushion is filled in between, the bottom plate is provided with a pillar for supporting the insulation cover, the insulation cover is an internal hollow structure, the insulation cover is connected with a liquid inlet pipe and a liquid outlet pipe, and the insulation cover is provided with a heating component and pumping Although the components have the effect of heat preservation, the heat preservation cover is integrated, which is inconvenient to disassemble and transport, and occupies a large space area

Method used

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  • External thermal insulation device of semiconductor heater
  • External thermal insulation device of semiconductor heater
  • External thermal insulation device of semiconductor heater

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Embodiment one, please emphatically refer to the attached Figure 1-7 As shown, an external thermal insulation device of a semiconductor heater includes a box body 1, and the box body 1 includes a bottom plate 11, and side plates 12 are symmetrically arranged on both sides of the upper surface of the bottom plate 11, and each of the side plates 12 The other side is provided with a backboard 13, and the upper surface of each side board 12 is provided with a top board 14, and the inside of the top board 14, the bottom board 11, the back board 13 and the side board 12 are all provided with a heat insulating layer 16 and a thermal insulation layer in sequence. Layer 17, each heat insulation layer 16 is symmetrically provided with a number of rectangular slots 161 on both sides, each of the rectangular slots 161 is provided with an H-shaped bracket 162, and each of the thermal insulation layers 17 is provided with an asbestos board 171, a semiconductor heating device 2 is in...

Embodiment 2

[0035] Embodiment two, please emphatically refer to the attached figure 1 , 3As shown in and 4, a display 4 is arranged on one side of the upper surface of the box body 1, and the display panel 4 includes a display panel 41. The lower surface of the display panel 41 is connected to the upper surface of the box body 1. On the display panel 41 One side of the surface is provided with a number of function buttons 42, through the function buttons 42, the operation of each device in the box body 1 is realized, and a display screen 43 is arranged near the side of the function button 42, and through the display screen 43, it is realized. For data control, a data interface 44 is provided on the side away from the function button 42, and the access to the data line is realized through the data interface 44. The other side of the upper surface of the box body 1 is provided with a power interface 141, through which The interface 141 realizes the access to the power supply and provides e...

Embodiment 3

[0036] Embodiment three, please emphatically refer to the attached Figure 5 , 6 As shown in and 7, a voltage box 26 is arranged near the outer wall side of the outlet pipe 25, the lower surface of the outer wall of the voltage box 26 is connected to the lower surface of the inner wall of the box body 1, and the outer wall side of the voltage box 26 is connected to the water outlet through a wire. The outer wall interfaces of the pipes 25 are connected to each other, through the voltage box 26, the control of voltage stability is realized, and the electrical equipment is protected. The intermediate shaft 34, the outer wall of the intermediate shaft 34 is provided with a connecting shaft 35, and the outer wall of the connecting shaft 35 is equidistantly surrounded by four fan blades 36, through the blower 3, the simple temperature and humidity control in the box body 1 is realized. regulation.

[0037] Concrete operation process of the present invention is as follows:

[003...

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PUM

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Abstract

The invention discloses an external thermal insulation device of a semiconductor heater, which comprises a box body, the box body comprises a bottom plate, side plates are symmetrically arranged on two sides of the upper surface of the bottom plate, a back plate is arranged on the other side of each side plate, and a top plate is arranged on the upper surface of each side plate. A heat insulation layer and a heat preservation layer are sequentially arranged in each of the top plate, the bottom plate, the back plate and the side plates, a semiconductor heating device is installed on one side of the inner wall of the box body, the semiconductor heating device comprises a water inlet pipeline, one end of the water inlet pipeline is connected with one side of the inner wall of the box body, a rectangular notch is formed in one side of the outer wall of the box body, and the rectangular notch is communicated with the water inlet pipeline. Through disassembly and assembly of the box body, in the transportation process of the box body, the occupied space area is reduced, movement is convenient, unnecessary manpower consumption is reduced, and the transportation efficiency is improved.

Description

technical field [0001] The invention mainly relates to the technical field of heaters, in particular to an external thermal insulation device for semiconductor heaters. Background technique [0002] An electric heater refers to an electrical appliance that uses electric energy to achieve a heating effect. It is small in size, high in heating power, and widely used. It adopts an intelligent control mode, has high temperature control accuracy, and can be networked with a computer. Wide range of applications, long life and high reliability. The core of the heater principle is energy conversion, the most common is the conversion of electrical energy into heat energy. [0003] In today's existing external heat preservation devices for semiconductor heaters, for example, in the technical structure of the application document CN202020301201.6, an electric heater and a bottom plate are included. The outer side of the electric heater is provided with a heat preservation cover. The ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B3/02H05B3/06
Inventor 王明东曹恒永
Owner 芜湖尼晶电子科技有限公司
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