Monocrystalline silicon wafer cleaning equipment

Abstract

The invention relates to the technical field of monocrystalline silicon wafers, in particular to monocrystalline silicon wafer cleaning equipment which comprises a cleaning machine body connected with a main body mechanism. An adjusting mechanism is arranged on the cleaning machine body in a matched and sliding mode. A storage mechanism is mounted on the adjusting mechanism; a shaking mechanism slides on the storage mechanism; an abutting mechanism is rotationally arranged on the cleaning machine body in a matched mode. The adjusting mechanism is opened, so that the adjusting mechanism slides in the cleaning machine body, and the monocrystalline silicon wafer can be cleaned for multiple times through the adjusting mechanism; the storage mechanism slides into the main body mechanism from the adjusting mechanism, so that the monocrystalline silicon wafers in the storage mechanism can be conveniently cleaned when the cleaning machine body is started; an operator turns on a control switch of the abutting mechanism, so that the abutting mechanism abuts against the storage mechanism in the main body mechanism when rotating, the storage mechanism drives the shaking mechanism to slide when being abutted, and the cleaning effect of the monocrystalline silicon wafer is improved conveniently when the silicon wafer shakes in the storage mechanism.

Description

technical field [0001] The invention relates to the technical field of monocrystalline silicon wafers, in particular to a cleaning device for monocrystalline silicon wafers. Background technique [0002] Single crystal silicon usually refers to a substance formed by an arrangement of silicon atoms. Silicon is the most common and widely used semiconductor material. When molten elemental silicon solidifies, silicon atoms are arranged in a diamond lattice to form crystal nuclei, and the crystal nuclei grow into crystal grains with the same crystal plane orientation, forming single crystal silicon. When cleaning monocrystalline silicon wafers, operators generally use ultrasonic cleaning machines to clean particles, organic matter and other impurities on the surface of polycrystalline silicon wafers. [0003] However, when the existing ultrasonic cleaning machine is in use, the operator needs to clean the silicon wafer several times, because the operation steps of taking the sil...

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Problems solved by technology

[0003] However, when the existing ultrasonic cleaning machine is in use, the operator needs to clean the silicon wafer several times, because the operation steps of taking the silicon wafer back and forth from the cleaning box and placing it in the new cleaning box are cumbersome, which is not conducive to Improve the cleaning speed of silicon wafers; in addition, the silicon wafers are placed directly in the cleaning box for cleaning, because the parts where multiple silicon wafers are stacked together are not easy to clean in place, and impurities are easy to adhere to the silicon wafers after cleaning. To a certain extent, it is not conducive to improving the cleaning effect of silicon wafers

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