Manufacturing method of chemical-resistant gold plating

A production method, chemical gold plating technology, applied in printed circuit manufacturing, non-metallic protective layer coating, printed circuit, etc., to achieve the effects of cost-effectiveness, increased roughness, and improved production quality

Pending Publication Date: 2022-04-22
珠海崇达电路技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims at the above-mentioned existing technical defects, and provides a production method of anti-chemical gold plating, which roughens the surface of the board by sandblasting before silk-screen printing the peelable blue glue, and improves the bonding force between the peelable blue glue and the board surface , and the peelable blue glue is used as the protective layer, which solves the quality problems caused by the use of dry film and ink

Method used

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Examples

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Embodiment

[0027] The manufacturing method of a kind of circuit board shown in the present embodiment, comprises the process of anti-chemical gold plating, comprises following processing procedure in turn:

[0028] (1) Cutting: Cut out the core board according to the panel size of 520mm×620mm. The thickness of the core board is 0.5mm, and the thickness of the copper layer on both surfaces of the core board is 0.5oz.

[0029] (2) Inner layer circuit production (negative film process): Inner layer graphics transfer, use a vertical coating machine to coat photosensitive film, the film thickness of the photosensitive film is controlled to 8 μm, use a fully automatic exposure machine, and use a 5-6 grid exposure ruler (21 grid exposure ruler) to complete the exposure of the inner layer circuit, and form the inner layer circuit pattern after development; inner layer etching, etch the exposed and developed core board to etch the inner layer circuit, and the inner layer line width is measured as ...

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Abstract

The invention discloses a manufacturing method for resisting chemical gold plating. The manufacturing method comprises the following steps: carrying out sand blasting treatment on a production board; silk-screening peelable blue gel on the production board and curing, and windowing at a position, corresponding to a position to be chemically plated, on the peelable blue gel; chemical nickel and gold plating treatment is conducted on the windowing position of the production board; and stripping the peelable blue glue on the production board. According to the method disclosed by the invention, the plate surface is coarsened through sand blasting before silk-screen printing of the peelable blue gel, the binding force between the peelable blue gel and the plate surface is improved, and the peelable blue gel is adopted as a protective layer, so that the quality problem caused by adopting a dry film and ink is solved.

Description

technical field [0001] The invention relates to the technical field of manufacturing printed circuit boards, in particular to a method for manufacturing anti-chemical gold plating. Background technique [0002] Gold surface treatment of printed circuit boards. During gold plating, it is necessary to protect the copper surface that does not require chemical gold plating, to avoid contact with liquid medicine and chemical plating of gold. Currently, silk screen solder resist ink or dry film is used for protection without chemical gold plating. copper surface. [0003] The way of pasting the dry film: pasting the dry film-exposure-developing-pre-treatment of immersion nickel gold-immersion nickel gold-removing the film; this method has the following disadvantages. First, for boards with uneven surfaces, the distance between the dry film and the board surface The binding force is poor, and there are problems of penetration plating and potion pollution. The second is that it nee...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28H05K3/00
CPCH05K3/282H05K3/0011
Inventor 敖四超何政轩刘晶黄健
Owner 珠海崇达电路技术有限公司
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