Copper foil removing equipment for UWB positioning base station substrate production

A technology for positioning base stations and substrates, applied in the field of electronics, can solve problems such as increased production costs, and achieve the effect of ensuring the effect of etching
CN114423162APending Publication Date: 2022-04-29HANGZHOU CCRFID MICROELECTRONICS
0 Cites 2 Cited by

Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
HANGZHOU CCRFID MICROELECTRONICS
Publication Date
2022-04-29

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention relates to the technical field of electronics, in particular to copper foil removing equipment for UWB positioning base station substrate production. The technical problem is that a copper foil on a substrate has impurity particles during pressing, after the copper foil is etched and removed, the impurity particles fall into blind holes of the substrate, and additional processing steps need to be added for processing, so that the production cost is increased. According to the technical scheme, the copper foil removing equipment for UWB positioning base station substrate production comprises a bottom frame, a collecting box and the like; a collecting box is connected to the left portion of the bottom frame. When the device is used, residual glue residues in the blind holes of the substrate are cleaned through the air jet, the damage to the substrate is avoided, meanwhile, the adverse effect of the glue residues on etching is avoided, only the lower surface of the substrate is etched through overturning each time, the upper surface is sealed and protected, and the production efficiency is improved. Impurity particles are prevented from falling into the blind holes of the substrate after the copper foil is etched and removed when the copper foil is pressed, and additional processing steps are avoided.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to the field of electronic technology, in particular to a copper foil removal device used for UWB positioning base station substrate production. Background technique

[0002] Substrate is the basic material for manufacturing PCB. In general, the substrate is copper-clad laminate. Single-sided and double-sided printed boards are manufactured on the substrate material-copper-clad laminate. Hole processing, chemical Copper plating, copper electroplating, etching and other processing to obtain the required circuit pattern.

[0003] In the prior art, during the production of odd-numbered-layer substrates for UWB positioning base stations, the copper foil on both sides of the cured sheet needs to be removed by etching. Since blind holes are formed on the cured sheet through laser drilling, the drop generated during drilling remains on the In blind holes, direct etching will have a negative impact on the removal of copper foil. Spraying...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More