The invention relates to the technical field of
electronics, in particular to
copper foil removing equipment for UWB positioning
base station substrate production. The technical problem is that a
copper foil on a substrate has
impurity particles during pressing, after the
copper foil is etched and removed, the
impurity particles fall into blind holes of the substrate, and additional
processing steps need to be added for
processing, so that the production cost is increased. According to the technical scheme, the
copper foil removing equipment for UWB positioning
base station substrate production comprises a bottom frame, a collecting box and the like; a collecting box is connected to the left portion of the bottom frame. When the device is used, residual glue residues in the blind holes of the substrate are cleaned through the air jet, the damage to the substrate is avoided, meanwhile, the
adverse effect of the glue residues on
etching is avoided, only the lower surface of the substrate is etched through overturning each time, the upper surface is sealed and protected, and the production efficiency is improved.
Impurity particles are prevented from falling into the blind holes of the substrate after the
copper foil is etched and removed when the
copper foil is pressed, and additional
processing steps are avoided.