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Method for improving oil spilling of single-sided windowing VIA hole after solder resist development

A solder mask, single-sided technology, used in printed circuits, electrical components, printed circuit manufacturing, etc., can solve the problems of repeated oil spills, easy oil spills, etc., to improve efficiency, ensure shrinkage quality, and reduce VIA hole oil spills bad effect

Pending Publication Date: 2022-05-03
HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these three methods only slightly improve the oil spillage after the para-position development. In the process of processing, the phenomenon of oil spillage is still easy to occur, and even oil spillage occurs repeatedly, and the problem cannot be completely solved.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A method for improving the oil spillage of single-sided window VIA holes after solder mask development, characterized in that it includes the following steps: material cutting - inner layer - pressing - drilling - whole board electroplating - image transfer - drawing electricity - etching and fading Film—AOI detection—solder mask plugging—solder mask surface oil printing—solder mask prebaking—solder mask pattern transfer—solder mask development—text printing—post-curing—forming—cleaning.

[0021] Further, the process of solder mask plugging—solder mask surface oil printing—solder mask prebaking—solder mask pattern transfer—solder mask development—text printing—post-curing, specifically: spare ink—board surface treatment—board Surface printing - low temperature baking - film production - exposure process - development production - oil surface curing.

[0022] Further, in the board surface printing, the plug hole is made from the reverse side of the oil spilled surface, t...

Embodiment 2

[0026] A method for improving the oil spillage of single-sided window VIA holes after solder mask development, characterized in that it includes the following steps: material cutting - inner layer - pressing - drilling - whole board electroplating - image transfer - drawing electricity - etching and fading Film—AOI detection—solder mask plugging—solder mask surface oil printing—solder mask prebaking—solder mask pattern transfer—solder mask development—text printing—post-curing—forming—cleaning.

[0027] Further, the process of solder mask plugging—solder mask surface oil printing—solder mask prebaking—solder mask pattern transfer—solder mask development—text printing—post-curing, specifically: spare ink—board surface treatment—board Surface printing - low temperature baking - film production - exposure process - development production - oil surface curing.

[0028] Further, in the board surface printing, the plug hole is made from the reverse side of the oil spilled surface, t...

Embodiment 3

[0032] A method for improving the oil spillage of single-sided window VIA holes after solder mask development, characterized in that it includes the following steps: material cutting - inner layer - pressing - drilling - whole board electroplating - image transfer - drawing electricity - etching and fading Film—AOI detection—solder mask plugging—solder mask surface oil printing—solder mask prebaking—solder mask pattern transfer—solder mask development—text printing—post-curing—forming—cleaning.

[0033] Further, the process of solder mask plugging—solder mask surface oil printing—solder mask prebaking—solder mask pattern transfer—solder mask development—text printing—post-curing, specifically: spare ink—board surface treatment—board Surface printing - low temperature baking - film production - exposure process - development production - oil surface curing.

[0034] Further, in the board surface printing, the plug hole is made from the reverse side of the oil spilled surface, t...

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PUM

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Abstract

The invention belongs to the technical field of PCBs, and particularly relates to a method for improving single-side windowing VIA hole oil spilling after solder resist development. Comprising the following steps of cutting, inner layer forming, press fit, drilling, whole board electroplating, image transfer, pattern plating, etching and film stripping, AOI detection, solder resist hole plugging, solder resist surface oil printing, solder resist pre-baking, solder resist pattern transfer, solder resist developing, character printing, post curing, forming and cleaning. According to the method disclosed by the invention, a 1.8-4mil green oil ring is added during preparation aiming at the problem that the VIA hole of a solder-resistant single-side windowing design product is easy to generate an oil-benefiting bad product, so that the phenomenon of bad oil spilling of the VIA hole at the single-side windowing after solder-resistant development is effectively improved.

Description

technical field [0001] The invention belongs to the technical field of PCBs, and in particular relates to an improved method for oil spillage from VIA holes with single-side window openings after solder mask development. Background technique [0002] In PCB board processing, after the outer layer circuit is made, it is necessary to make solder protection and plug hole treatment for the outer layer circuit and via holes to protect the outer layer circuit from oxidation or short circuit during soldering and residual liquid in the hole after development. In the existing PCB board manufacturing process, some special structural products such as PCB boards designed with single-sided windows often have frequent oil spills after the solder mask is exposed and developed. The solder mask ink overflows to the single-sided window The copper surface of the VIA hole (via hole) affects the appearance requirements of the product and reduces the quality of the product. [0003] In the produ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28H05K3/00
CPCH05K3/282H05K3/0094
Inventor 陈剑芳杨鹏飞李小海
Owner HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
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