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Temperature-resistant anti-aging insulating dielectric paste and preparation method thereof

An insulating medium, anti-aging technology, applied in insulators, resistor parts, resistors, etc., can solve problems such as internal stress cracking, durability reduction, etc., to improve temperature resistance, aging resistance, heat resistance, and voltage resistance. large value effect

Active Publication Date: 2022-05-10
西安宏星电子浆料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The secondary insulating dielectric paste is used as the outermost protective film of the chip resistor. It overlaps with the alumina substrate layer, electrode layer, and glass encapsulation layer. It needs to have good compatibility and adhesion. During use, due to changes in the external environment, it will cause oxidative aging, high and low temperature cooling and heat conversion to form internal stress cracks, etc., resulting in reduced durability and other adverse phenomena.

Method used

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  • Temperature-resistant anti-aging insulating dielectric paste and preparation method thereof
  • Temperature-resistant anti-aging insulating dielectric paste and preparation method thereof
  • Temperature-resistant anti-aging insulating dielectric paste and preparation method thereof

Examples

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Embodiment 1

[0022] The temperature-resistant and anti-aging insulating dielectric paste of this embodiment is made of the following raw materials by weight: 6% diphenylsilicone, 24% bisphenol A epoxy resin, 57% temperature-resistant base material, 4.5% diphenylsilane Ethylene glycol butyl ether, 1.2% aminomethoxysilane, 2.3% diaminodiphenyl sulfone, 5% insulating carbon black, and the preparation method thereof includes the following steps:

[0023] (1) Preparation of temperature-resistant base material: according to the weight percentage composition, 41% spherical silica with a particle size of 2 to 5 μm, 32.5% of spherical silica with a sphericity of 95% of hollow glass beads with a particle size of 3 to 8 μm, 17 % talc powder and 9.5% mica powder are mixed uniformly to obtain a temperature-resistant inorganic filler; according to the composition by weight percentage, 20% diethylene glycol butyl ether, 37% ethylene glycol ethyl ether acetate, 27% ethylene glycol butyl ether, 27% ethylene...

Embodiment 2

[0026] The temperature-resistant and anti-aging insulating dielectric paste of this embodiment is made of the following raw materials by weight: 7.5% diphenylsilicone diol, 22.5% bisphenol A epoxy resin, 57% temperature-resistant base material, 4.5% diphenylsilane Ethylene glycol butyl ether, 1.2% aminomethoxysilane, 2.3% diaminodiphenyl sulfone, 5% insulating carbon black, wherein the weight percent composition of the temperature-resistant base material and the preparation method of the slurry are the same as those in Example 1 same.

Embodiment 3

[0028] The temperature-resistant and anti-aging insulating dielectric paste of this embodiment is made of the following raw materials by weight: 10% phenyltrimethoxysiloxane, 20% bisphenol A epoxy resin, 57% temperature-resistant base material, 4.5% % diethylene glycol butyl ether, 1.2% aminomethoxysilane, 2.3% diaminodiphenyl sulfone, 5% insulating carbon black, wherein the weight percent composition of the temperature-resistant binder and the preparation method and example of the slurry 1 is the same.

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Abstract

The invention discloses a temperature-resistant anti-aging insulating medium slurry and a preparation method thereof, the temperature-resistant anti-aging insulating medium slurry comprises organic silicon resin, a temperature-resistant base material, bisphenol A epoxy resin, an organic solvent, amino methoxy silane, a curing agent and a black pigment, the temperature-resistant base material is prepared from a temperature-resistant inorganic filler and an organic carrier, the temperature-resistant inorganic filler is prepared from silicon dioxide, hollow glass beads, talcum powder and mica powder. The paste is cured at 200 DEG C by adopting a silk-screen printing process, a protective film formed by curing the paste has the characteristics of good temperature resistance, aging resistance, insulation resistance and voltage resistance, the viscosity of the paste is stable, the surface of the cured film is smooth, flat and pore-free, and the paste has a wide market prospect in the industries of chip resistors and electronic encapsulation.

Description

technical field [0001] The invention belongs to the technical field of insulating medium slurry, in particular to a temperature-resistant and anti-aging insulating medium slurry and a preparation method thereof. Background technique [0002] As one of the basic materials of electronic component products, electronic paste is also the core component of electronic components, which plays a decisive role in the performance of electronic products. With the development of electronic components and electronic modules to a high degree of integration and miniature volume, the calorific value is getting larger and larger, and the aging problems of components caused by temperature rise are increasing. Among them, insulating medium paste is used to protect electronic components from Key functional materials damaged by the external environment. [0003] Due to its light, small and thin characteristics, chip resistors are widely used in the fields of automotive electronics, industrial el...

Claims

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Application Information

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IPC IPC(8): H01B3/00H01B19/00H01C1/034
CPCH01B3/008H01B19/00H01C1/034Y02E60/10
Inventor 不公告发明人
Owner 西安宏星电子浆料科技股份有限公司
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