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A kind of temperature-resistant and anti-aging insulating medium slurry and preparation method thereof

An insulating medium, anti-aging technology, applied in insulators, resistor parts, resistors, etc., can solve problems such as internal stress cracking, durability reduction, etc., to improve temperature resistance, aging resistance, heat resistance, and insulation properties. The effect of high and low temperature resistance

Active Publication Date: 2022-07-08
西安宏星电子浆料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The secondary insulating dielectric paste is used as the outermost protective film of the chip resistor. It overlaps with the alumina substrate layer, electrode layer, and glass encapsulation layer. It needs to have good compatibility and adhesion. During use, due to changes in the external environment, it will cause oxidative aging, high and low temperature cooling and heat conversion to form internal stress cracks, etc., resulting in reduced durability and other adverse phenomena.

Method used

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  • A kind of temperature-resistant and anti-aging insulating medium slurry and preparation method thereof
  • A kind of temperature-resistant and anti-aging insulating medium slurry and preparation method thereof
  • A kind of temperature-resistant and anti-aging insulating medium slurry and preparation method thereof

Examples

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Effect test

Embodiment 1

[0022] The temperature-resistant and anti-aging insulating dielectric paste of this embodiment is made of the following raw materials by weight: 6% diphenylsilicone, 24% bisphenol A epoxy resin, 57% temperature-resistant base material, 4.5% diphenylsilane Ethylene glycol butyl ether, 1.2% aminomethoxysilane, 2.3% diaminodiphenyl sulfone, 5% insulating carbon black, and the preparation method thereof comprises the following steps:

[0023] (1) Preparation of temperature-resistant base material: according to the weight percentage composition, 41% spherical silica with a particle size of 2 to 5 μm, 32.5% of spherical silica with a sphericity of 95% of hollow glass beads with a particle size of 3 to 8 μm, 17 % talc powder and 9.5% mica powder are mixed uniformly to obtain a temperature-resistant inorganic filler; according to the composition by weight percentage, 20% diethylene glycol butyl ether, 37% ethylene glycol ethyl ether acetate, 27% ethylene glycol butyl ether, 27% ethylen...

Embodiment 2

[0026] The temperature-resistant and anti-aging insulating dielectric paste of this embodiment is made of the following raw materials by weight: 7.5% diphenylsilicone diol, 22.5% bisphenol A epoxy resin, 57% temperature-resistant base material, 4.5% diphenylsilane Ethylene glycol butyl ether, 1.2% aminomethoxysilane, 2.3% diaminodiphenyl sulfone, 5% insulating carbon black, wherein the weight percent composition of the temperature-resistant base material and the preparation method of the slurry are the same as those in Example 1 same.

Embodiment 3

[0028] The temperature-resistant and anti-aging insulating dielectric paste of this embodiment is made of the following raw materials by weight: 10% phenyltrimethoxysiloxane, 20% bisphenol A epoxy resin, 57% temperature-resistant base material, 4.5% % diethylene glycol butyl ether, 1.2% aminomethoxysilane, 2.3% diaminodiphenyl sulfone, 5% insulating carbon black, wherein the weight percent composition of the temperature-resistant binder and the preparation method and example of the slurry 1 is the same.

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Abstract

The invention discloses a temperature-resistant and anti-aging insulating medium slurry and a preparation method thereof. It is composed of black pigment, and the temperature-resistant base material is made of a temperature-resistant inorganic filler and an organic carrier, and the temperature-resistant inorganic filler is composed of silicon dioxide, hollow glass microbeads, talc powder, and mica powder. The paste of the present invention adopts a screen printing process and is cured at 200° C. The protective film formed by the paste curing has good temperature resistance, anti-aging, insulation resistance and voltage resistance characteristics, the paste viscosity is stable, and the surface of the cured film is smooth and flat without pores. , has broad market prospects in chip resistors and electronic packaging industries.

Description

technical field [0001] The invention belongs to the technical field of insulating medium slurry, in particular to a temperature-resistant and anti-aging insulating medium slurry and a preparation method thereof. Background technique [0002] As one of the basic materials of electronic component products, electronic paste is also the core component of electronic components, which plays a decisive role in the performance of electronic products. With the development of electronic components and electronic modules to a high degree of integration and miniature volume, the calorific value is getting larger and larger, and the aging problems of components caused by temperature rise are increasing. Among them, insulating medium paste is used to protect electronic components from Key functional materials damaged by the external environment. [0003] Due to its light, small and thin characteristics, chip resistors are widely used in the fields of automotive electronics, industrial el...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B3/00H01B19/00H01C1/034
CPCH01B3/008H01B19/00H01C1/034Y02E60/10
Inventor 不公告发明人
Owner 西安宏星电子浆料科技股份有限公司
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