Redundant silicon-based photoelectric integrated chip

Abstract

The invention provides a redundant silicon-based photoelectric integrated chip, each channel of the silicon-based photoelectric integrated chip is internally provided with an optical power monitoring module, and each optical power monitoring module is composed of at least two parallel monitoring detector units. By adopting a redundant MPD mode, that is, at least one parallel MPD is designed to serve as redundant equipment, the yield of the photoelectric integrated chip is greatly improved, extra influence brought by the mode is small, an extra control circuit or other real-time monitoring systems are not needed, and the advantages of being simple in structure, small in size and low in cost are achieved.

Description

technical field [0001] The invention belongs to the technical field of optical communication and photoelectric integrated chip, in particular to a redundant silicon-based photoelectric integrated chip. Background technology [0002] Optical communication has become a key communication technology in the communication field because of its advantages of high bandwidth, large capacity, small volume, light weight, good anti-interference and long transmission distance. In recent years, with the explosive growth of traffic, Internet companies continue to build new data centers to meet the increasing traffic demand. Among them, silicon optical integration technology can better meet the communication requirements of low cost, high integration, low power consumption and large capacity because of its material characteristics and the advantages of compatibility with CMOS process. It plays an important role in backbone network, data center and 5g construction. [0003] Silicon optical integra...

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Problems solved by technology

[0004] However, as the integration of a single chip increases, the chip often contains dozens of unit devices or components, and the yield rate of these unit devices will have a greater impact on the yield rate of the integrated chip.

Taking the eight-channel silicon photonics integrated MZI modulator chip as an example, a single chip needs 16 monitor detector units (MPD, Monitor Photo detector) to monitor the optical signal input and output power of the eight channel modulators respectively. Calculated at a rate of 95%, the yield rate of MPD alone will cause the yield rate of this chip to drop to 44%

If components such as electro-optical modulators, thermal phase shifters, and optocouplers are considered, the yield rate of integrated chips will be lower, and the cost of optoelectronic integrated chips will be greatly challenged.

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